Characterization of Sn–Sb–Ti Solder Alloy and the Study of Its Use for the Ultrasonic Soldering Process of SiC Ceramics with a Cu–SiC Metal–Ceramic Composite

Abstract

The aim of this research was to characterize soldering alloys of the type Sn–Sb–Ti and to study the ultrasonic soldering of SiC ceramics with a metal–ceramic composite of the type Cu–SiC. The Sn5Sb3Ti solder exerts a thermal transformation of a peritectic character with an approximate melting point of 234 °C and a narrow melting interval. The solder microstructure consists of a tin matrix, where the acicular constituents of the Ti6(Sb,Sn)5 phase and the sharp-edged constituents of the TiSbSn phase are precipitated. The tensile strength of the soldering alloy depends on the Ti content and reaches values from 34 to 51 MPa. The average strength of the solder increases with increasing Ti content. The bond with SiC ceramics is formed owing to the interaction of titanium, activated by ultrasound, with SiC ceramics, forming the (Ti,Si)6(Sb,Sn)5 reaction product. The bond with the metal–ceramic composite Cu–SiC is formed owing to the solubility of Cu in a tin solder forming two phases: the wettable η-Cu6Sn5 phase, formed in contact with the solder, and the non-wettable ε-Cu3Sn phase, formed in contact with the copper composite. The average shear strength of the combined joint of SiC/Cu–SiC fabricated using the Sn5Sb3Ti solder was 42.5 MPa. The Sn–Sb–Ti solder is a direct competitor of the S-Bond active solder. The production of solders is cheaper, and the presence of antimony increases their strength. In addition, the application temperature range is wider.

Study of Wettability and Solderability of SiC Ceramics with Ni by Use of Sn-Sb-Ti Solder by Heating with Electron Beam in Vacuum

“…Based on our previous research [ 34 ], the onset point at double heating corresponded to temperatures of 227.8 °C and 225.9 °C, while during cooling it corresponded to temperatures of 224.6 °C and 224.1 °C. The peak at heating corresponded to temperatures of 240.2 and 241.6 °C.…”

“…The DTA analysis did not reveal any other reactions. The difference in the onset point values at heating was caused by the heterogeneity of the initial alloy due to precipitated phases, namely the primary solidified phase with an acicular morphology and a high titanium content, i.e., Ti 6 (Sn,Sb) 5 , whereby a considerable portion of titanium was exhausted, and the remaining titanium reacted with the Sn-Sb melt, forming a brittle TiSnSb phase [ 34 ].…”

“…The solder structure, which was also analyzed in our previous study [ 34 ], consists of a tin matrix, where irregular constituents of intermetallic phases of tin and antimony occur. In principle, two kinds of phases, namely the light-grey and dark-grey, are of concern.…”

“…The diffraction XRD analysis of Sn5Sb3Ti was analyzed in our previous study [ 34 ]. The solder proved the presence of tin (Sn) and antimony (Sb), as well as the presence of intermetallic phases of titanium and antimony, namely Ti 6 Sb 5 , Ti 6 Sn 5 and TiSbSn.…”

Properties of Cu/Zn+15%SAC0307+15%Cu/Al joints by different ultrasonic-assisted degrees

“…Nowadays, ultrasonic soldering technology has aroused ever-increasing attention and intense efforts (Zulkifli et al, 2019). Especially in electronic packaging industry, research mainly focus on metal substrates such as Al (Guo et al, 2017), Cu (Gan et al, 2019), ceramic materials igure 2 Soldering seam of joints by different ultrasonic loading degrees (Kolenak et al, 2021) or soldering of metals and ceramics (Yi et al, 2022;Li et al, 2022a). , the maximum shear strength of joint could reach 22.76 MPa under a 30 s ultrasonic-assisted time.…”