2007
DOI: 10.1016/j.tsf.2006.11.107
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Characterization of SiNx/a-Si:H crystalline silicon surface passivation under UV light exposure

Abstract: One of the most promising solution for crystalline silicon surface passivation in solar cell fabrication consists in a low temperature (b 400°C) Plasma Enhanced Chemical Vapor Deposition of a double layer composed by intrinsic hydrogenated amorphous silicon (a-Si:H) and hydrogenated amorphous silicon nitride (SiN x ). Due to the high amount of hydrogen in the gas mixture during the double layer deposition, the passivation process results particularly useful in case of multi-crystalline silicon substrates in wh… Show more

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Cited by 25 publications
(14 citation statements)
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“…In particular we ascribe this effect to the large amount of positive charge density that lay inside the SiN x and at interface with a-Si:H. These charges are able to perform an inversion layer within the silicon wafer so strong that the Fermi level position, at the wafer back edge, is shifted close to the conduction band. This effect reduces the probability of recombination at the Si/a-Si:H interface [6].…”
Section: Resultsmentioning
confidence: 99%
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“…In particular we ascribe this effect to the large amount of positive charge density that lay inside the SiN x and at interface with a-Si:H. These charges are able to perform an inversion layer within the silicon wafer so strong that the Fermi level position, at the wafer back edge, is shifted close to the conduction band. This effect reduces the probability of recombination at the Si/a-Si:H interface [6].…”
Section: Resultsmentioning
confidence: 99%
“…Around the grid a 15 µm deep trench has been buried by CP4 wet etching at 4°C fixing the area of the cell to 4 cm 2 . To ensure passivation of both device surfaces a double thin layer of amorphous silicon and silicon nitride, a-Si: H/SiN x , deposited in a 13.56MHz plasma enhanced chemical vapor deposition (PECVD) system has been adopted [6]. In particular the a-Si:H layer has been deposited at 250°C, 750 mTorr and 15W RF power, 120 cm of 5% SiH 4 diluted in Ar.…”
Section: Methodsmentioning
confidence: 99%
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“…Then the wafer has been turned over to deposit the passivation/anti-reflection coating. We have preferred to passivate the sunward side by the (aSi:H/SiN x ) double layer instead of single SiN x layer, since it has been demonstrated to better passivate crystalline silicon surface with respect to the SiN x [11]. In turn, we lose part of the blue sun spectrum due to the a-Si:H absorption of the high energy photons.…”
Section: Methodsmentioning
confidence: 99%
“…Typically, amorphous-crystalline silicon heterostructures are prepared by depositing thin-layers of intrinsic and doped hydrogenated amorphous silicon (a-Si:H) onto the surface of a c-Si wafer using either radio-frequency (RF) or very-high frequency (VHF) plasma enhanced chemical vapor deposition (PECVD) [6][7][8][9]. The benefits of these deposition methods are that they allow for a-Si:H growth over large areas with high uniformity and reproducibility.…”
Section: Introductionmentioning
confidence: 99%