2020
DOI: 10.3390/ma13071796
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Characterization of Platinum-Based Thin Films Deposited by Thermionic Vacuum Arc (TVA) Method

Abstract: The current work aimed to characterize the morphology, chemical, and mechanical properties of Pt and PtTi thin films deposited via thermionic vacuum arc (TVA) method on glass and silicon substrates. The deposited thin films were characterized by means of a scanning electron microscope technique (SEM). The quantitative elemental microanalysis was done using energy-dispersive X-ray spectroscopy (EDS). The tribological properties were studied by a ball-on-disc tribometer, and the mechanical properties were measur… Show more

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Cited by 4 publications
(4 citation statements)
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“…The thin-film thickness normally includes one or few atomic layers. The mechanical properties of these films are much more strongly influenced by grain size, grain shape, crystallographic texture, the interatomic potentials and surface energy [14,[17][18][19].…”
Section: Introductionmentioning
confidence: 99%
“…The thin-film thickness normally includes one or few atomic layers. The mechanical properties of these films are much more strongly influenced by grain size, grain shape, crystallographic texture, the interatomic potentials and surface energy [14,[17][18][19].…”
Section: Introductionmentioning
confidence: 99%
“…Adhesion can be enhanced by an intermediate titanium (Ti) protective coating between a Pt film and the substrate or including the Ti into the Pt matrix. This is supported by the fact that these two metals exhibit quite similar melting points: T Ti = 1941 K and T Pt = 2041.4 K. At the same time, the state of surfaces in the operating conditions of these components becomes more important due to the development and miniaturization of device components [ 2 ].…”
mentioning
confidence: 99%
“…3 Especially, TVA shows high performance for the high melting point materials and ceramic materials thin film depositions. [1][2][3][4][5][6] Early design TVA can deposit only metal vapor plasma and metallic thin film deposition. Nowadays, TVA used to deposit high melting point materials and ceramic materials deposition such as B, C, ZnO, ZrO 2 , B 4 C, W, Ti, SnO, … and etc.…”
mentioning
confidence: 99%
“…The flexibility of the TVA method enables to produce thin films on glass and silicon substrates. 4 Recent studies focus on generating layers that contain more than one material in order to obtain desired properties. 21,22 Most used substrates are glass, Si and PET which are needed to investigate electrical and optical properties of coatings.…”
mentioning
confidence: 99%