1999
DOI: 10.1149/1.1391781
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Characterization of Ni x Fe1 − x     ( 0.10 < x < 0.95 )  Electrodeposition from a Family of Sulfamate‐Chloride Electrolytes

Abstract: The characteristics of a nickel sulfamate/iron chloride plating bath suitable for high rate electrodeposition of NiFe alloys are described. The effects of current density, electrolyte agitation, and Ni ϩ2 /Fe ϩ2 content on deposit composition and plating current efficiency are explored via stripping voltammetry using a rotating ring-disk electrode. Specific plating bath formulations and operating conditions for depositing a wide range of alloy compositions at a variety of growth rates are illustrated. Special … Show more

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Cited by 93 publications
(46 citation statements)
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“…This increase can be attributed to an increase of FeSO 4 concentrations in the electrolyte, resulting in an increase of Fe content in the film structure. An enhancement revealed in the lattice parameter with the Fe content was also reported in fcc structure Ni-Fe films [1,33] and also in fcc structure Ni-Cu-Fe thin films [13]. However, the lattice parameter of the fcc (111) peak decreases with increase of the deposition potential.…”
Section: Resultssupporting
confidence: 54%
“…This increase can be attributed to an increase of FeSO 4 concentrations in the electrolyte, resulting in an increase of Fe content in the film structure. An enhancement revealed in the lattice parameter with the Fe content was also reported in fcc structure Ni-Fe films [1,33] and also in fcc structure Ni-Cu-Fe thin films [13]. However, the lattice parameter of the fcc (111) peak decreases with increase of the deposition potential.…”
Section: Resultssupporting
confidence: 54%
“…1,2 Investigations of the electrodeposition of Fe and Ni alloys have been carried out mainly to identify the ability of these alloys to display stable, beneficial magnetic properties at room temperature. 3,4 Fe and Ni alloy deposits are used in the electronic industry for memory devices 5,6 and for hydrogen evolution reactions (HER).…”
Section: Introductionmentioning
confidence: 99%
“…A compact graphite plate was used as counter-electrode. The common solution was composed of 0.9 M NH 4 by dissolution of the required amounts of metal compounds in the common solution as shown in Table 1. The films were deposited with thicknesses from 200 up to 700 nm at current densities from 5 to 25 A/dm 2 , as was reported earlier [13].…”
Section: Methodsmentioning
confidence: 99%
“…The Ni-Fe alloy films have been used in the electronic industries for storage, recording and memory devices for computers [3][4][5]. Electrodeposition was the first method used for alloy films ranging from Permalloy (Ni 78 Fe 22 ) to Invar (Ni 36 Fe 64 ) [4][5][6][7][8]. It also was an effective process for producing alloy films due to their flexibility, low cost and capability of being used for parts with different geometry [9].…”
Section: Introductionmentioning
confidence: 99%