Characterization of MEMS piezoresistive pressure sensors using AFM

Patil, Suraj Kumar; Çelik‐Butler, Zeynep; Butler, Donald P.

doi:10.1016/j.ultramic.2010.04.012

Cited by 15 publications

(7 citation statements)

References 14 publications

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“…Considering an AFM piezo vertical displacement

during the measurement required to move the sample position, it is noticeable that

combines both the AFM probe and MEMS sensor displacements, as shown in Figure 1 . Thus, the resulting sensor displacement

can be calculated as follows [ 6 , 7 , 8 , 9 ]:

…”

Section: Introductionmentioning

confidence: 99%

“…In Patil et al [ 6 ], an AFM in contact mode is used for the characterization and calibration of a piezoresistive pressure sensor designed for tactile sensing applications. In this paper, the probe-tip was modified by attaching a spherical soda-lime glass particle to its end so as to increase the contact area and simulate a uniform pressure application.…”

Section: Introductionmentioning

confidence: 99%

“…Moreover, the modulus of elasticity of the material is derived by nanoidentation. Besides, AFM-based measurements have been reported to be of great use to characterize pressure sensors, for example, of the piezoresistive type [ 6 ]. However, no literature has been found that treated the problem of both analytically and Finite Element (FE) modelling the deflection versus force behavior of non-coated capacitive MEMS pressure biosensors, together with their experimental characterizing using an AFM in contact mode, used to apply a force that permits to estimate the corresponding deflection of the top plate and, thus its sensitivity.…”

Section: Introductionmentioning

confidence: 99%

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AFM-Based Characterization Method of Capacitive MEMS Pressure Sensors for Cardiological Applications

2018

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Current CMOS-micro-electro-mechanical systems (MEMS) fabrication technologies permit cardiological implantable devices with sensing capabilities, such as the iStents, to be developed in such a way that MEMS sensors can be monolithically integrated together with a powering/transmitting CMOS circuitry. This system on chip fabrication allows the devices to meet the crucial requirements of accuracy, reliability, low-power, and reduced size that any life-sustaining medical application imposes. In this regard, the characterization of stand-alone prototype sensors in an efficient but affordable way to verify sensor performance and to better recognize further areas of improvement is highly advisable. This work proposes a novel characterization method based on an atomic force microscope (AFM) in contact mode that permits to calculate the maximum deflection of the flexible top plate of a capacitive MEMS pressure sensor without coating, under a concentrated load applied to its center. The experimental measurements obtained with this method have allowed to verify the bending behavior of the sensor as predicted by simulation of analytical and finite element (FE) models. This validation process has been carried out on two sensor prototypes with circular and square geometries that were designed using a computer-aided design tool specially-developed for capacitive MEMS pressure sensors.

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“…Considering an AFM piezo vertical displacement

during the measurement required to move the sample position, it is noticeable that

combines both the AFM probe and MEMS sensor displacements, as shown in Figure 1 . Thus, the resulting sensor displacement

can be calculated as follows [ 6 , 7 , 8 , 9 ]:

…”

Section: Introductionmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

See 1 more Smart Citation

AFM-Based Characterization Method of Capacitive MEMS Pressure Sensors for Cardiological Applications

2018

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“…Piezoresistive gauges 14,15 are insensitive to environmental degradation and have a straightforward approach for signal detection. Packaging is generally low cost, and devices are easy to miniaturize.…”

Section: Introductionmentioning

confidence: 99%

Frontside-micromachined planar piezoresistive vibration sensor: Evaluating performance in the low frequency test range

Zhang

Takagi

et al. 2014

AIP Advances

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Articles you may be interested inUsing a surface piezoresistor diffusion method and front-side only micromachining process, a planar piezoresistive vibration sensor was successfully developed with a simple structure, lower processing cost and fewer packaging difficulties. The vibration sensor had a large sector proof mass attached to a narrow flexure. Optimization of the boron diffusion piezoresistor placed on the edge of the narrow flexure greatly improved the sensitivity. Planar vibration sensors were fabricated and measured in order to analyze the effects of the sensor dimensions on performance, including the values of flexure width and the included angle of the sector. Sensitivities of fabricated planar sensors of 0.09-0.46 mV/V/g were measured up to a test frequency of 60 Hz. The sensor functioned at low voltages (<3 V) and currents (<1 mA) with a high sensitivity and low drift. At low background noise levels, the sensor had performance comparable to a commercial device. C 2014 Author(s)

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“…Gauge factors (GFs) of 4.5 to 17 and temperature coefficients of resistance (TCR) between −0.4 and −0.1%/K were obtained for the developed film. Patil et al [25], [26] reported on piezoresistive properties of polysilicon obtained by the AIC process (annealing at 475 up to 550°C for 90 min) for tactile sensor applications. A polyimide layer was used as a sacrifice layer to build the membrane structure for the tactile sensor, and GFs were estimated to be in the range of 6.6 to 11.7 for an estimated strain of approximately 1.5×10 −3 applied on the piezoresistors.…”

mentioning

confidence: 99%

Polysilicon Thin Film Developed on Flexible Polyimide for Biomedical Applications

Hartings

et al. 2016

J. Microelectromech. Syst.

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Flexible pressure and thermal sensors are the critical parts of the functional electronic skin of prostheses and robots, as well as flexible catheter/devices for multimodal biomedical monitoring. In this paper, a polysilicon thin film was developed on a flexible polyimide substrate using aluminum induced crystallization process for biomedical pressure and temperature sensing applications. The formation of polycrystalline structure was verified from the developed polysilicon film. Long term stability and real-time temperature tests were performed to evaluate potential application to the in vivo monitoring of brain or body temperature. The linear real-time change of polysilicon resistance with temperature was attained with the temperature coefficient of the resistance of −0.0027/°C and the resolution of 0.05°C. With a gauge factor of 10.3, the polysilicon film developed in this paper represents a promising material for the development of high-sensitivity pressure sensors on flexible polyimide substrates.[ 2015-0106]Index Terms-Aluminum induced crystallization (AIC), biomedical temperature and pressure, polysilicon film on polyimide, temperature coefficient of resistance (TCR), gauge factor.

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Characterization of MEMS piezoresistive pressure sensors using AFM

Cited by 15 publications

References 14 publications

AFM-Based Characterization Method of Capacitive MEMS Pressure Sensors for Cardiological Applications

AFM-Based Characterization Method of Capacitive MEMS Pressure Sensors for Cardiological Applications

Frontside-micromachined planar piezoresistive vibration sensor: Evaluating performance in the low frequency test range

Polysilicon Thin Film Developed on Flexible Polyimide for Biomedical Applications

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