“…However oxygen and hydrogen incorporation in films produced in the pulsed mode [8,9] and in DC operation [10] is also often reported. It is believed the contamination originates from the water vapor layer that forms on the cathode surface between arc pulses when working in high vacuum, due to the residual water vapor present in the chamber, or from backstreaming of diffusion pump oil in case of DC operation [10]. The problem of water contamination can be particularly important in the case of deposition of materials with getter properties, like Niobium, Titanium, Vanadium, Zirconium.…”