2008
DOI: 10.1016/j.apsusc.2007.11.025
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Characterization of ion beam sputter deposited W and Si films and W/Si interfaces by grazing incidence X-ray reflectivity, atomic force microscopy and spectroscopic ellipsometry

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Cited by 7 publications
(1 citation statement)
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“…Electron-cyclotron-resonance ion beam sputter deposition (ECR-IBSD) has been demonstrated as a potential technique for fabricating complex oxide films with high crystalline quality and flat surface. It also provides several advantages, such as well-controlled ion energy and growth rate, low operating pressure, (~5 × 10 −5 -5 × 10 −4 Torr), good film adhesion, and ease of fab-rication of thin film over a large area [8,9]. The ECR ion source is a non-filament type, leading to a long lifetime and allowing for the use of various kinds of gas species [10].…”
Section: Introductionmentioning
confidence: 99%
“…Electron-cyclotron-resonance ion beam sputter deposition (ECR-IBSD) has been demonstrated as a potential technique for fabricating complex oxide films with high crystalline quality and flat surface. It also provides several advantages, such as well-controlled ion energy and growth rate, low operating pressure, (~5 × 10 −5 -5 × 10 −4 Torr), good film adhesion, and ease of fab-rication of thin film over a large area [8,9]. The ECR ion source is a non-filament type, leading to a long lifetime and allowing for the use of various kinds of gas species [10].…”
Section: Introductionmentioning
confidence: 99%