Characterization of Impact of Vertical Stress on FinFETs

Furuhashi, Takahisa; Liu, Y.; Hiblot, Gaspard; Vanstreels, Kris; González, Mario; Velenis, Dimitrios; Beyer, Gerald; Plas, G. Van der; Wolf, Ingrid De; Beyne, Eric; Haneda, M.; Sasaki, Takuya; Kagawa, Y.; Ooka, Y.; Hirano, Takuichi; Saito, Masaki; Ohno, Keiichi; Iwamoto, Hayato

doi:10.23919/empc44848.2019.8951822

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Characterization of Impact of Vertical Stress on FinFETs

Cited by 3 publications

References 8 publications

The Pressing Probe Needle Technique for Characterizing Mechanical Stress Sensitivity of Semiconductor Devices

The Pressing Probe Needle Technique for Characterizing Mechanical Stress Sensitivity of Semiconductor Devices

On the impact of mechanical stress on gate oxide trapping

Investigation of the Impact of Externally Applied Out-of-Plane Stress on Ferroelectric FET

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