2010
DOI: 10.1016/j.mee.2009.06.012
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Characterization of direct patterned Ag circuits for RF application

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Cited by 27 publications
(8 citation statements)
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“…The printing process are done only at the place where required and follow the design pattern which are prepared earlier (Vasudivan & Zhiping, 2010). The printing quality and the fine line printing resolution patterns is necessary in order to achieve high component density and high frequency applications (Dubey, 1975;Kim et al, 2010). Successful transferred pattern onto the substrate depends on the rheology of the paste material.…”
Section: Basic Information/thick-film Materialsmentioning
confidence: 99%
“…The printing process are done only at the place where required and follow the design pattern which are prepared earlier (Vasudivan & Zhiping, 2010). The printing quality and the fine line printing resolution patterns is necessary in order to achieve high component density and high frequency applications (Dubey, 1975;Kim et al, 2010). Successful transferred pattern onto the substrate depends on the rheology of the paste material.…”
Section: Basic Information/thick-film Materialsmentioning
confidence: 99%
“…3, the main factor that affected the phenomena of interparticle necking and coarsening was the sintering temperature. screen printing, ink-jet printing, and gravure printing), and could therefore be one of their most distinguishable features and disadvantages [12]. Fig.…”
Section: Resultsmentioning
confidence: 99%
“…Yet the electrical performances of printed traces in the higher frequency range (gigahertz range) have been subjected to little investigation to date [2]. Rather, work abounds on the effect of sintering conditions on the DC electrical resistivity of printed traces [2]- [7], due to the applications considered which are in the lower frequency domain (e.g.…”
Section: Introductionmentioning
confidence: 99%
“…RFID tags operating at megahertz frequencies, solar cells). While Kim et al [2] reported the RF characterization of inkjet-printed transmission lines up to 30 GHz on silicon, little information was available on whether the RF results were realistic or within a reasonable benchmark. In addition, Salmeron et al [8] used a 2.5D electromagnetic simulator to evaluate the electrical performance of transmission lines against the fabricated structures, but only up to a frequency of 1.2 GHz.…”
Section: Introductionmentioning
confidence: 99%
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