Characterization of alumina-based LTCC composite materials: Thermal and electrical properties

Ibrahim, Adnan; Alias, Rosidah; Ambak, Zulkifli; Yusoff, Mohd Zulfadli Mohamed; Shapee, Sabrina Mohd; Saad, Muhammad Redzuan; Yusoff, Ashaari; Mahmood, Che Seman; Ahmad, Megat Harun Al Rashid Megat

doi:10.1109/eptc.2010.5702646

Cited by 5 publications

(5 citation statements)

References 9 publications

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“…The sintering temperature of Al 2 O 3 is relatively high at about 1600°C. The main challenge behind making Al 2 O 3 as LTCC/ULTCC material is its high sintering temperature . Low melting and low‐loss glasses are known to be effective sintering aids for reducing the sintering temperature of various ceramics without much affecting the microwave properties .…”

Section: Introductionmentioning

confidence: 99%

“…The main challenge behind making Al 2 O 3 as LTCC/ULTCC material is its high sintering temperature. 14,15 Low melting and low-loss glasses are known to be effective sintering aids for reducing the sintering temperature of various ceramics without much affecting the microwave properties. 3 The traditional method to lower the sintering temperature of the Al 2 O 3 is by glass addition.…”

Section: Introductionmentioning

confidence: 99%

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Microwave dielectric properties of SnO‐SnF₂‐P₂O₅ glass and its composite with alumina for ULTCC applications

Induja

Sebastian

2017

J Am Ceram Soc

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Ultralow‐temperature sinterable alumina‐45SnF2:25SnO:30P2O5 glass (Al2O3‐SSP glass) composite has been developed for microelectronic applications. The 45SnF2:25SnO:30P2O5 glass prepared by melt quenching from 450°C has a low Tg of about 93°C. The SSP glass has εr and tanδ of 20 and 0.007, respectively, at 1 MHz. In the microwave frequency range, it has εr=16 and Qu × f=990 GHz with τf=−290 ppm/°C at 6.2 GHz with coefficient of thermal expansion (CTE) value of 17.8 ppm/°C. A 30 wt.% Al2O3‐70 wt.% SSP composite was prepared by sintering at different temperatures from 150°C to 400°C. The crystalline phases and dielectric properties vary with sintering temperature. The alumina‐SSP composite sintered at 200°C has εr=5.41 with a tanδ of 0.01 (1 MHz) and at microwave frequencies it has εr=5.20 at 11 GHz with Qu × f=5500 GHz with temperature coefficient of resonant frequency (τf)=−18 ppm/°C. The CTE and room‐temperature thermal conductivity of the composite sintered at 200°C are 8.7 ppm/°C and 0.47 W/m/K, respectively. The new composite has a low sintering temperature and is a possible candidate for ultralow‐temperature cofired ceramics applications.

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Section: Introductionmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

Microwave dielectric properties of SnO‐SnF₂‐P₂O₅ glass and its composite with alumina for ULTCC applications

Induja

Sebastian

2017

J Am Ceram Soc

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“…Obviously the thermal conductivity decreases with increase in temperature. This is believed to be due to the fact that with increase in temperature, phonon collision increases and their mobility decreases, which will reduce the ability of heat to transfer from the source [16]. Thermal conductivity being a microstructure sensitive property, the glass-ceramic composite materials are likely to have lower thermal conductivities, either due to poor thermal properties of the glass or due to the inclusion of entrapped porosity which is very common in such composites.…”

Section: Resultsmentioning

confidence: 95%

“…Alumina is considered as the workhorse in microelectronic industry [15] due to its low dielectric constant, low loss, high thermal conductivity, low cost etc. The main challenge for making alumina as LTCC is its high sintering temperature; however, it is very difficult to obtain a coherently dense body below 1000 1C [16]. Various methods have been adopted to lower the sintering temperature of alumina.…”

Section: Introductionmentioning

confidence: 99%

LTCC tapes based on Al2O3–BBSZ glass with improved thermal conductivity

Induja

Abhilash

Arun

et al. 2015

Ceramics International

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“…This may be due to the decrease of phonon pathway [32]. Thermal diffusivity, which is an intrinsic material property, depends on microstructure, density, crystal structure of the phase and grain size of the material [33]. Most of the LTCC materials have low thermal conductivity due to the poor thermal conductivity of the glassy phase [15].…”

Section: Dielectric Propertiesmentioning

confidence: 99%

Low κ, low loss alumina-glass composite with low CTE for LTCC microelectronic applications

Induja

Surendran

Varma

et al. 2017

Ceramics International

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Alumina based low κ LTCC composite has been prepared with the use of AGC commercial glass (DL828). The 30 wt% Al2O3-70 wt% AGC glass composite was sintered at 875 °C (2 h). X-ray diffraction study indicated the presence of BaSi2O5, BaAl2Si2O8 and Ba2Si3O8 secondary phases in addition to Al2O3 in the composite. The bulk ceramic sintered at 875 °C has κ of 4.80 and tan δ of 0.007 at 1 MHz. The composite shows good microwave dielectric properties: κ of 4.52, tan δ of 0.004 and τκ close to zero. The composite has a low CTE of 4.38 ppm/°C which is close to that of silicon used in microelectronic industry and thermal conductivity of 1.41 W m −1 K −1 at room temperature. The results indicate that the Al2O3-AGC glass composite has good dielectric, thermal properties and is chemically compatible with Ag electrode indicating it as a promising candidate for low κ LTCC substrate applications.

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Characterization of alumina-based LTCC composite materials: Thermal and electrical properties

Cited by 5 publications

References 9 publications

Microwave dielectric properties of SnO‐SnF₂‐P₂O₅ glass and its composite with alumina for ULTCC applications

Microwave dielectric properties of SnO‐SnF₂‐P₂O₅ glass and its composite with alumina for ULTCC applications

LTCC tapes based on Al2O3–BBSZ glass with improved thermal conductivity

Low κ, low loss alumina-glass composite with low CTE for LTCC microelectronic applications

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Characterization of alumina-based LTCC composite materials: Thermal and electrical properties

Cited by 5 publications

References 9 publications

Microwave dielectric properties of SnO‐SnF2‐P2O5 glass and its composite with alumina for ULTCC applications

Microwave dielectric properties of SnO‐SnF2‐P2O5 glass and its composite with alumina for ULTCC applications

LTCC tapes based on Al2O3–BBSZ glass with improved thermal conductivity

Low κ, low loss alumina-glass composite with low CTE for LTCC microelectronic applications

Contact Info

Product

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About

Microwave dielectric properties of SnO‐SnF₂‐P₂O₅ glass and its composite with alumina for ULTCC applications

Microwave dielectric properties of SnO‐SnF₂‐P₂O₅ glass and its composite with alumina for ULTCC applications