Characteristics of Thermosetting Polymer Nanocomposites: Siloxane-Imide-Containing Benzoxazine with Silsesquioxane Epoxy Resins

Abstract

A series of innovative thermosetting polymer nanocomposites comprising of polysiloxane-imide-containing benzoxazine (PSiBZ) as the matrix and double-decker silsesquioxane (DDSQ) epoxy or polyhedral oligomeric silsesquioxane (POSS) epoxy were prepared for improving thermosetting performance. Thermomechanical and dynamic mechanical characterizations indicated that both DDSQ and POSS could effectively lower the coefficient of thermal expansion by up to approximately 34% and considerably increase the storage modulus (up to 183%). Therefore, DDSQ and POSS are promising materials for low-stress encapsulation for electronic packaging applications.

Hydroxyalkyl-substituted double-decker silsesquioxanes: effective separation ofcisandtransisomers

“…Those reactions were conducted on hydroxyalkyl-substituted alkenes not blocked with TMS or by using epoxides, thus avoiding the stage of deprotection of the blocking group. [37][38][39][40] The syntheses of difunctionalized by hydroxyalkyl substituents double-decker silsesquioxanes are depicted with Scheme 1. In general, all derivatives were synthesized in the reaction between 1 and allyl alcohol (A; in the case of 2), ethylene glycol vinyl ether (B; 3), and 3-allyloxy-1,2-propanediol (C; 4) (Fig.…”

“…Those reactions were conducted on hydroxyalkyl-substituted alkenes not blocked with TMS or by using epoxides, thus avoiding the stage of deprotection of the blocking group. 37–40…”

Metal Complexes of the Porphyrin-Functionalized Polybenzoxazine

“…Because strong inter- and intramolecular hydrogen bonds exist after the thermal ROP of BZ units, formed among the tertiary amino and phenolic units in the Mannich bridges, the polymerization products can possess low dielectric constants, low surface free energies, low degrees of shrinkage, and high thermal stabilities and char yields [ 14 , 15 , 16 , 17 , 18 , 19 , 20 ]. Flexibility in molecular design—by varying the structures of the phenolic and amino groups—has allowed the introduction of a range of functional groups (e.g., allyl, propargyl, crown ether) [ 21 , 22 , 23 , 24 , 25 , 26 , 27 , 28 , 29 , 30 , 31 ] or inorganic nanomaterials (such as polyhedral oligomeric silsesquioxane, graphene, carbon nanotube) [ 32 , 33 , 34 , 35 , 36 , 37 , 38 , 39 , 40 , 41 ] into the BZ matrix.…”

Synthesis and Thermal Degradation Study of Polyhedral Oligomeric Silsesquioxane (POSS) Modified Phenolic Resin

“…Phenolic resin is an indispensable foundational material in the field of aerospace thermal protection materials due to its excellent thermal stability, solvent resistance and structural integrity, and it is also a precursor of C/C composite materials [1,2]. However, some of the properties of phenolic resin still need to be further improved to meet the growing performance requirements of aerospace thermal protection materials [3][4][5].…”