“…It was further notified that application of low temperature GaN (LT-GaN) or AlN layer could reduce misfit dislocations also in other technologies [5]. Nowadays, various materials are applied as a buffer layers including: LT-GaN [5,6,7], HT-GaN [8], AlN [8,9,10] and ZnO [11,12]. Also many complicated techniques have been developed which allowed to reduce the density of threading dislocations in heteroepitaxial GaN layers.…”