Characteristics of fire and explosion in semiconductor fabrication processes

Abstract

The characteristics of fire and explosion in semiconductor fabrication processes differ from those in the chemical process industries. Case studies are given to illustrate the common, as well as peculiar features of fire and explosion in the fabrication processes. In particular, the process exhaust systems, usually involving flammable, pyrophoric and corrosive gases and vapors, were shown to be a major fire and explosion source. With some preliminary understanding of the semiconductor process, standard chemical process safety knowledge can be readily applied to semiconductor processes.

Environmental and health risks of chlorine trifluoride (ClF3), an alternative to potent greenhouse gases in the semiconductor industry

“…Further, ClF 3 is nonflammable in air, but may form a flammable mixture with other flammable gases (e.g., dichlorosilane) as a result of accidental mixing in the CVD chamber [20]. It was found that the lower flammability limit (LFL) of a ClF 3 /SiH 2 Cl 2 /N 2 mixture is 0.3 vol% for both ClF 3 and dichlorosilane (SiH 2 Cl 2 ), which is lower than the LFL (i.e., 4.1%) of SiH 2 Cl 2 in air [13]. It is very important because dichlorosilane (SiH 2 Cl 2 ) is a flammable gas, which is used in the tungsten-silicon CVD process [20].…”

“…The accidental cases resulting from its spill or leakage were reported [12,13]. Furthermore, the extreme reactivity of ClF 3 may produce many hazardous products.…”

“…Obviously, the hazards (e.g., toxic release) in semiconductor fabrication processes differ from those in the chemical process industries [13]. From the literature surveyed, only few researches have addressed the environmental chemistry of ClF 3 and its atmospheric implications in terms of high fluorosis risks due to its significant increase in the commercial uses, especially in the semiconductor industry [5].…”

The simulation of air recirculation and fire/explosion phenomena within a semiconductor factory

“…Owing to the diversity of hazardous materials such as silane, phosphine, hydrogen, isopropyl alcohol, dichlorosilane, and the like that are often used during different processing operations, a fire and explosion accident might happen if any one of these materials were released from a leaking pipe, storage tank, or machinery [1], not to mention that some of them can even be poisonous to people and the environment. A fire and explosion accident cannot only cause human casualty and property damage, but the smoke particles arising from an incomplete combustion can also threaten the cleanliness of the fabrication area (fab) and severely damage the quality of the products.…”

Assessment of fire protection performance of water mist applied in exhaust ducts for semiconductor fabrication process

“…Some pyrophoric-like gases ignite spontaneously in air at a temperature below 548C. The fume exhaust duct, used to exhaust these highly flammable gases out of workstations, can be a potential fire source as well as a way to spread fire [3]. In Taiwan two major fires occurred in 1996 and 1997, respectively.…”