Characteristics of copper deposition in a supercritical CO2 fluid

Continuous Flow Supercritical Chemical Fluid Deposition of Optoelectronic Quality CdS

“…[1][2][3][4] One technologically relevant example is the damascene process deposition of conformal low-resistivity copper interconnects within the latest generation 32 nm node integrated circuits. [5] Furthermore, SCFD technology can be extended to a wide range of metals, including Cu, Ni, [6] Au, Ru, Co, Rh, and Ir [7][8][9][10][11] into macro-and meso-structured environments for a variety of applications, particularly micro-electronics. More recently SCFD has been demonstrated as uniquely suitable for the deposition of metals, polymers, and elemental semiconductors into ''micro-structured'' optical fibers enabling a new generation of photonic devices including chemical sensors [12] and optical modulators.…”

Nanoscale States in Metals, Alloys, and Intermetallic Compounds: Methods of Manufacture, Structure, Properties

“…Хорошие результаты получе-ны так же для серебра [88], ведутся разработки реакций для по-лучения пленок алюминидов титана и многослойных интерме-таллических нанопленок с использованием SCFP процессов. По-следние японские и американские исследования показали пер-спективность метода для получения тонких покрытий, приме-няемых в микроэлектронике и химической промышленности [89][90][91].…”

Supercritical CO2 reactor for wafer-scale thin film deposition: reactor concept, numerical results, and Cu depositio.

“…This technique is called supercritical fluid chemical deposition, frequently abbreviated SFCD or SCFD. Metal deposition using this technique has been reported for Cu [1][2][3], Ni [2][3][4], Pd [2,5,6], Pt [5,7,8], Rh [5], Ru [9,10], Au [5], and Ag [11,12]. To deposit a metal, a precursor (an organometallic compound) is dissolved in scCO 2 along with hydrogen or another reducing agent [12] if necessary, and the metal is deposited through a thermal reaction.…”