Abstract:An evaporating meniscus in a microchannel is investigated through an augmented Young-Laplace model and the kinetic theory-based expression for mass transport across a liquid-vapor interface. The complete expression for mass transport is employed without any approximations and boundary conditions for the film profile are developed. The thin-film and the intrinsic-meniscus regions are distinguished based on the disjoining pressure variation along the meniscus. While heat transfer in the thin-film region is found… Show more
“…The heat exhibition of the heat pipe for expanding and diminishing heat motions are contrasted and refined water while using 10 wt % of Al 2 O 3 NF falls apart the heat pipe heat execution Wang, Garimella [20]. When the heat transfer effectiveness with thermo siphon has own importance the rate of heat transfer can be calculated Wilson, Q. Yu et al [21].…”
Section: Performance Of Heat Pipe With Different Parametersmentioning
Heat transfer applications are most investigative area with the evolution of micro chips in electronics field; thermal equilibrium maintenance becomes a challenging task in heat pipes because of their reliability, simple structure as well as cost. Heat pipe is one of the well known heat transfer device, can transport large quantity of heat from one place to another without any additional power. Working fluid has its role on performance on the basis of its conductivity, because heat pipes have high thermal conductive nature. This review focuses on the submission of Nano-fluids in place of conventional fluids used in heat pipe. This paper reveals the researches on thermosyphons, heat pipes and oscillating heat pipes, for reduction in thermal resistance, enhancing the thermal efficiency and heat transfer coefficient of a heat pipe. Various input parameters and their ranges those affect the performance of heat pipe like heat input, angle of inclination, filling ratio, Nanoparticle material, size, shape and concentration of Nano-fluid, considered in different studies has been reviewed.
“…The heat exhibition of the heat pipe for expanding and diminishing heat motions are contrasted and refined water while using 10 wt % of Al 2 O 3 NF falls apart the heat pipe heat execution Wang, Garimella [20]. When the heat transfer effectiveness with thermo siphon has own importance the rate of heat transfer can be calculated Wilson, Q. Yu et al [21].…”
Section: Performance Of Heat Pipe With Different Parametersmentioning
Heat transfer applications are most investigative area with the evolution of micro chips in electronics field; thermal equilibrium maintenance becomes a challenging task in heat pipes because of their reliability, simple structure as well as cost. Heat pipe is one of the well known heat transfer device, can transport large quantity of heat from one place to another without any additional power. Working fluid has its role on performance on the basis of its conductivity, because heat pipes have high thermal conductive nature. This review focuses on the submission of Nano-fluids in place of conventional fluids used in heat pipe. This paper reveals the researches on thermosyphons, heat pipes and oscillating heat pipes, for reduction in thermal resistance, enhancing the thermal efficiency and heat transfer coefficient of a heat pipe. Various input parameters and their ranges those affect the performance of heat pipe like heat input, angle of inclination, filling ratio, Nanoparticle material, size, shape and concentration of Nano-fluid, considered in different studies has been reviewed.
“…The fourth‐order Runge–Kutta procedure and the shooting method were used to solve the equations. The guessed initial conditions (∂δ/∂ x )| x =0 and $\dot{m}$ v | x =0 are determined iteratively to satisfy the boundary conditions at x = L 2, 3, 7: …”
Section: Theoretical Modelmentioning
confidence: 99%
“…1 can be typically divided into three regions: the intrinsic meniscus region where capillary forces dominate, the evaporating thin film region which is affected by both long‐range intermolecular forces (the disjoining pressure) and capillary forces, and the non‐evaporating film region governed by the disjoining pressure. Strong evaporation and most of the interfacial temperature drop occur in the thin film region due to the very small thermal resistance 1–3. The liquid pressure gradient is caused by the capillary pressure gradient due to variation in the film curvature and the disjoining pressure gradient resulting from film thickness changes in the evaporating thin film region.…”
Section: Introductionmentioning
confidence: 99%
“…2. Most studies 1–3 have assumed there is no temperature jump at the wall and the effects of the Kapitza resistance and the ordered micro layer are negligible, so T wl = T w . However, mismatches between the liquid and solid properties give rise to a discontinuity‐related thermal resistance known as the Kapitza resistance 4, 5.…”
The microscopic liquid flow and heat transfer characteristics near the solidliquid interface in the evaporating thin film region of a mini channel were investigated based on the augmented Young-Laplace equation and kinetic theory. A physical model using the boundary layer approximation and a constant slip length was developed to obtain the solid-liquid interfacial thermal resistances and interfacial temperatures. The results show that the ordered micro layer and micro flow near the wall reduce the effective liquid superheat and the liquid pressure difference mainly due to the reduced capillary pressure gradient. The solid-liquid interfacial thermal resistances and U-shaped temperature drops tend to reduce the thin film spreading and heat transfer. The effects of the solid-liquid interfacial thermal resistances on the thin film evaporation outweigh the effects of the thermal conductivity enhancement due to the liquid ordering. The concepts of the micro flow and ordered adsorbed flowing micro layer are clarified to express the Kapitza resistance analytically in terms of the slip length and micro layer thickness.
“…These assumptions for the adsorbed region allow for the determination of initial conditions by inspection. As the film cannot evaporate, the mass flux balance for the adsorbed region has a net mass exchange of zero, despite being subjected to an applied superheat [7,10,12,15]. Thus it may be inferred that the principal mode of heat transfer is conduction through the adsorbed layer [7,12,15].…”
High power density systems utilising phase change heat transfer devices such as heat pipes can be susceptible to evaporation driven meniscus dynamics and instability.To better understand this, an study of evaporating meniscus dynamics and instability was needed. A mathematical model describing evaporating meniscus dynamics was developed in which meniscus height was correlated with superheat. Subsequent validation experiments confirmed the model was consistent with the general trends including the superheat to meniscus height relation.The study of evaporating meniscus instability was investigated using a one-sided model and a linear stability analysis. The analysis considered the effects of long range molecular forces, surface tension, vapour recoil, evaporation, thermocapillarity and viscous forces. The potential for instability was studied for three film geometries, for which the potential for instability was found to be spatially dependent for the curved cases, with perturbation growth rates increasing with superheat.An experimental study of channel based evaporating meniscus instability was performed for eight channel widths and three fluids: n-pentane, iso-octane and acetone.The meniscus height to superheat correlation was used to infer the superheat at which the meniscus destabilised. The experiments revealed two kinds of instability. The first was localised to a narrow range of superheats and unique to the alkanes, the second common to all three fluids and sustained for higher superheats. The second kind of instability was found to require larger superheats for decreasing channel widths.
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