2012
DOI: 10.1002/pssa.201127557
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Characteristics and simulation analysis of GaN‐based vertical light emitting diodes via wafer‐level additional surface roughening process

Abstract: We report the device characteristics of InGaN/GaN blue vertical light emitting diodes (VLEDs) by additional KOH surface roughening process through the wafer-level fabrication/ test, and their simulation analysis in terms of electrical and optical properties. The influence of additional KOH etching time on the evolution of the rough surface and the device performance of VLEDs was investigated. With applying the additional surface roughening, the average operating voltage was gradually increased. In contrast, th… Show more

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Cited by 3 publications
(3 citation statements)
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“…Therefore, decreasing Fresnel reflection and expanding the critical angle at the GaN-air interface will be necessary. Several approaches have been developed to expand the critical angle at the GaN-air interface; for example, surface roughening through wet chemical etching, 3,4 dry etching, [5][6][7] or the fabrication of heterogeneous random structures comprising zinc oxide (ZnO) [8][9][10][11] or indium tin oxide (ITO) 12,13 on the surface of the LED to prevent total internal reflection. The application of periodic photonic crystal (PhC) structures is also a common method for expanding the critical angle at the GaN-air interface.…”
Section: Introductionmentioning
confidence: 99%
“…Therefore, decreasing Fresnel reflection and expanding the critical angle at the GaN-air interface will be necessary. Several approaches have been developed to expand the critical angle at the GaN-air interface; for example, surface roughening through wet chemical etching, 3,4 dry etching, [5][6][7] or the fabrication of heterogeneous random structures comprising zinc oxide (ZnO) [8][9][10][11] or indium tin oxide (ITO) 12,13 on the surface of the LED to prevent total internal reflection. The application of periodic photonic crystal (PhC) structures is also a common method for expanding the critical angle at the GaN-air interface.…”
Section: Introductionmentioning
confidence: 99%
“…On the other hand, a major source of optical output power loss is due to light being trapped within the materials due to the optical properties,which affects the light extraction efficiency of the LED. Various methods, such as surface roughening [8], [9], [10], [11], patterned substrates [12], [13], [14], integration of DBRs and photonic crystals [15], [16], [17] are being utilized by research groups to improve LED extraction efficiency [18]. These methods add additional complexities to the fabrication process of the LEDs.…”
mentioning
confidence: 99%
“…In the recent years, several extraction methods have been developed and improved to address this problem. Techniques like chip shaping [8], [9], encapsulation [10], surface roughening [11], [12], [13], [14], patterned substrates [15], [16], [17], [18], integration of DBRs and photonic crystals [19], [20], [21] and the combination of them are usually deployed to improve the extraction in the LEDs. Each of these techniques has a unique approach and addresses a particular segment of the issue.…”
Section: Statement Of Dissertationmentioning
confidence: 99%