Chemical Vapour Deposition
DOI: 10.1039/9781847558794-00158
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Chapter 4. Atomic Layer Deposition

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Cited by 49 publications
(63 citation statements)
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“…In general, two main reasons have been proposed to limit the growth rate in ALD: steric hindrance between the adsorbed precursor molecules, and limited number of reactive sites on the surface. [53] Relatively low growth rates have often been observed when using bulky metal thd precursors. For example, saturated growth rates of about 0.20 and 0.15 Å cycle −1 were reported using Ni(thd) 2 [60] and La(thd) 3 , [61] respectively, with H 2 S.…”
Section: Film Growth On Siliconmentioning
confidence: 99%
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“…In general, two main reasons have been proposed to limit the growth rate in ALD: steric hindrance between the adsorbed precursor molecules, and limited number of reactive sites on the surface. [53] Relatively low growth rates have often been observed when using bulky metal thd precursors. For example, saturated growth rates of about 0.20 and 0.15 Å cycle −1 were reported using Ni(thd) 2 [60] and La(thd) 3 , [61] respectively, with H 2 S.…”
Section: Film Growth On Siliconmentioning
confidence: 99%
“…ALD offers large-area uniformity and precise control over film thickness, as well as unmatched conformality, i.e., uniform thickness over substrates with complex 3D shapes. [53][54][55] So far, ALD of MoS 2 has been reported using MoCl 5 with H 2 S, [43][44][45][46] as well as Mo(CO) 6 with H 2 S, [47,52] H 2 S plasma, [48] or dimethyl disulfide. [49][50][51] The films deposited with Mo(CO) 6 have mostly been amorphous due to the low deposition temperatures of 100-200 °C, [47,[49][50][51] although the films deposited with H 2 S plasma were polycrystalline.…”
Section: Introductionmentioning
confidence: 99%
“…[39,40] The ALD thin film technique employed here is based on selflimiting surface-saturative reactions of alternately pulsed gaseous precursors. This unique deposition mechanism allows for the excellent thickness control for homogeneous and pinhole-free thin films deposited on high aspect ratio geometries [41,42]. Copper oxides (CuO and Cu2O) have previously been deposited on various surfaces and geometries via ALD using several copper precursor/oxygen source combinations [43,44,45,46].…”
Section: Introductionmentioning
confidence: 99%
“…The ALD processes were studied in more detail from both experimental and theoretical standpoints [12]. This is mainly due to the presence of simpler and clearer concepts concerning the chemical reactions occurring on the substrate during the ALD process [13] as compared with MOCVD [14,15].…”
Section: Introductionmentioning
confidence: 99%