We have demonstrated a novel method of depositing ALD-Al2O3/PECVD-SiO2 bi-layer dielectric to passive the surface channels of the hydrogen-terminated diamond (H-diamond). After Al2O3/SiO2 passivation, the surface current increased with time and then tended to be saturated. Afterwards, it became much more stable and showed a larger current than an unpassivated counterpart. The H-diamond MOSFETs were fabricated by using this bi-layer passivation structure and an extremely low Ohmic contact resistance of 0.87 Ω•mm was obtained. The H-diamond RF MOSFET with gate length of 0.45 μm achieved a high current density of -549 mA/mm and an extrinsic fT/fmax of 15/36 GHz. By load-pull measurement, a high output power density of 1.04 W/mm was obtained at frequency of 2 GHz. The results reveal that it is a promising solution for high-stable and high-power diamond transistors by using the Al2O3/SiO2 bi-layer passivation.
Index Terms-H-diamond, bi-layer passivation, output power.
I. INTRODUCTIONINCE the first hydrogen-terminated diamond (H-diamond) transistor was born in 1994, the H-diamond has attracted more and more attentions to develop high performance RF transistors for its remarkable properties such as high concentration of two dimensional hole gas (2DHG), large critical breakdown electric field of 10 MV/cm, as well as high thermal conductivity of 22 W•cm -1 •K -1 [1-3]. Although some breakthroughs have been realized, the performances of the H-diamond transistors are still far from expected [4][5][6][7][8][9]. One of the most important reasons is that the large surface resistance caused by its low 2DHG mobility has limited their performances [10]. In addition, the H-diamond transistors, especially those fabricated by using a self-aligned process, always suffer from instabilities for lack of effective passivation Manuscript