Channel cracking of β-NiAl thin films on Si substrates

Wellner, P.; Kraft, O.; Dehm, Gerhard; Andersons, J.; Arzt, Eduard

doi:10.1016/j.actamat.2004.01.023

Cited by 37 publications

(16 citation statements)

References 46 publications

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“…This is also in contrast to existing studies on brittle thin films on substrates, where no distinct change in fracture toughness 35,36 or decreasing fracture toughness with increasing film thickness 15 ). 19 This clearly shows the need to include the stress relaxation by plastic deformation in the analysis of the fracture toughness.…”

Section: Fracture Toughness Analysis Including Plasticitycontrasting

confidence: 52%

Brittle-to-ductile transition in ultrathin Ta/Cu film systems

2009

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Current semiconductor technology demands the use of compliant substrates for flexible integrated circuits. However, the maximum total strain of such devices is often limited by the extensibility of the metallic components. Although cracking in thin films is extensively studied theoretically, little experimental work has been carried out thus far.Here, we present a systematic study of the cracking behavior of 34 to 506 nm thick Cu films on polyimide with 3.5 to 19 nm-thick Ta interlayers. The film systems have been investigated by a synchrotron-based tensile testing technique and in situ tensile tests in a scanning electron microscope. By relating the energy release during cracking obtained from the stress-strain curves to the crack area, the fracture toughness of the Cu films can be obtained. It increases with Cu film thickness and decreases with increasing Ta film thickness. Films thinner than 70 nm exhibit brittle fracture, indicating an increasing inherent brittleness of the Cu films.

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Section: Fracture Toughness Analysis Including Plasticitycontrasting

confidence: 52%

Brittle-to-ductile transition in ultrathin Ta/Cu film systems

2009

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“…compressive residual stress). Detailed experimental studies have been performed for cracks propagating in the film and extending from the surface of film to the film-substrate interface [85] and furthermore penetrating into the substrate [85,86].…”

Section: Crack In Film With Tip In Substrate and Spallingmentioning

confidence: 99%

A review of theoretical analysis techniques for cracking and corrosive degradation of film-substrate systems

Nazir

Khan

2017

Engineering Failure Analysis

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This paper contains a review of the most vital concepts regarding the analysis and design of film systems. Various techniques have been presented to analyse and predict the failure of films for all common types of failure: fracture, delamination, general yield, cathodic blistering, erosive and corrosive wear in both organic and inorganic films. Interfacial fracture or delamination is the loss of bonding strength of film from substrate, and is normally analysed based on the fracture mechanics concepts of bi-material systems. Therefore, keeping the focus of this review on bonding strength, the emphasis will be on the interfacial cracking of films and the corresponding stresses responsible for driving the delamination process. The bi-material characteristics of film systems make the nature of interfacial cracks as mixed mode, with cracks exhibiting various complex patterns such as telephone cord blisters. Such interfacial fracture phenomenon has been widely studied by using fracture mechanics based applicable analysis to model and predict the fracture strength of interface in film systems. The incorporation of interfacial fracture mechanics concepts with the thermodynamics/diffusion concepts further leads to the development of corrosive degradation theories of film systems such as cathodic blistering. This review presents the suggestions for improvements in existing analysis techniques to overcome some of the limitations in film failure modelling. This comprehensive review will help researchers, scientists, and academics to understand, develop and improve the existing models and methods of film-substrate systems.

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“…The relatively large plane-strain modulus of AlTa is in line with its high melting point; its fracture toughness is quite typical for intermetallic compounds. The fracture toughness of bulk NiAl, for instance, is in the range of 4-12 MPam 1/2 , while that of NiAl thin films is 2-3 MPam 1/2 (Wellner et al 2004).…”

Section: Resultsmentioning

confidence: 99%

Measuring the fracture toughness of ultra-thin films with application to AlTa coatings

et al. 2007

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An experimental technique is presented for measuring the fracture toughness of brittle thin films. In this technique, long rectangular membranes are fabricated from the film of interest using standard silicon micromachining techniques. A focused ion beam is then used to introduce pre-cracks of different lengths along the centerline of the membranes and the membranes are pressurized until rupture. The fracture stress of the membrane is measured as a function of pre-crack length and the fracture toughness of the film is determined from a simple fracture mechanics analysis. The technique is applicable to a wide range of materials and is especially suited for ultra-thin films. We have demonstrated the experimental procedure for a 150 nm AlTa intermetallic film and obtained a room-temperature fracture toughness of K 1c = 4.44 ± 0.21 MPam 1/2 .

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Channel cracking of β-NiAl thin films on Si substrates

Cited by 37 publications

References 46 publications

Brittle-to-ductile transition in ultrathin Ta/Cu film systems

Brittle-to-ductile transition in ultrathin Ta/Cu film systems

A review of theoretical analysis techniques for cracking and corrosive degradation of film-substrate systems

Measuring the fracture toughness of ultra-thin films with application to AlTa coatings

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