In recent development of deformable electronics, it has been noticed that thin metal films often rupture at small tensile strains. Here we report experiments with Cu films deposited on polymeric substrates and show that the rupture strains of the metal films are sensitive to their adhesion to the substrates. Well-bonded Cu films can sustain strains up to 10% without appreciable cracks and up to 30% with discontinuous microcracks. By contrast, poorly bonded Cu films form channel cracks at strains about 2%. The cracks form by a mixture of strain localization and intergranular fracture. The films rupture at large strains when the localization is retarded by the adherent substrates.

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The plane-strain bulge test is a powerful new technique for measuring the mechanical properties of thin films. In this technique, the stress-strain curve of a thin film is determined from the pressure-deflection behavior of a long rectangular membrane made of the film of interest. For a thin membrane in a state of plane strain, film stress and stain are distributed uniformly across the membrane width, and simple analytical formulae for stress and strain can be established. This makes the plane-strain bulge test ideal for studying the mechanical behavior of thin films in both the elastic and plastic regimes. Finite element analysis confirms that the plane-strain condition holds for rectangular membranes with aspect ratios greater than 4 and that the simple formulae are highly accurate for materials with strain-hardening exponents ranging from 0 to 0.5. The residual stress in the film mainly affects the elastic deflection of the membrane and changes the initial point of yield in the plane-strain stress-strain curve, but has little or no effect on further plastic deformation. The effect of the residual stress can be eliminated by converting the plane-strain curve into the equivalent uniaxial stress-strain relationship using effective stress and strain. As an example, the technique was applied to an electroplated Cu film. Si micromachining was used to fabricate freestanding Cu membranes. Typical experimental results for the Cu film are presented. The data analysis is in good agreement with finite element calculations.

The Lewis acid/base passivation strategy and its effects on energy level alignment, recombination kinetics, hysteresis behavior and operational stability for efficient perovskite solar cells are comprehensively reviewed.

Numerous microencapsulation techniques have been developed to encase various chemicals, for which specific processing parameters are required to address the widely differing features of the encapsulated materials. Microencapsulation of reactive agents is a powerful technique that has been extensively applied to self‐healing materials. However, the poor solvent compatibility and insufficient thermal stability of microcapsules continue to pose challenges for long‐term storage, processing, and service in practical applications. Here, an easily modifiable and highly versatile method is reported for preparing various chemicals filled poly(urea‐formaldehyde) microcapsules that exhibit superior tightness against solvents and heat and that possess widely tunable, repetitiously self‐restorable, and solvent‐proof superhydrophobicity. In addition, the low‐cost fabrication of biomimetic multifunctional smart coatings is demonstrated for self‐healing anticorrosion and self‐cleaning antifouling applications by directly dispersing the superhydrophobic microcapsules into and onto a polymer matrix. The methodology presented in this study should inspire the development of multifunctional intelligent materials for applications in related fields.

HDI-filled silica/polyurea hybrid microcapsules with superior thermal stability and solvent resistance were prepared and applied to one-part self-healing anticorrosion coatings.

Metal selenides are considered as a group of promising candidates as the anode material for sodium-ion batteries due to their high theoretical capacity. However, the intrinsically low electrical and ionic conductivities as well as huge volume change during the charge-discharge process give rise to an inferior sodium storage capability, which severely hinders their practical application. Herein, we fabricated In2Se3/CoSe2 hollow nanorods composed of In2Se3/​CoIn2/​CoSe2 by growing cobalt-based zeolitic imidazolate framework ZIF-67 on the surface of indium-based metal–organic framework MIL-68, followed by in situ gaseous selenization. Because of the CoIn2 alloy phase in between In2Se3 and CoSe2, a heterostructure consisting of two alloy/selenide interfaces has been successfully constructed, offering synergistically enhanced electrical conductivity, Na diffusion process, and structural stability, in comparison to the single CoIn2-free interface with only two metal selenides. As expected, this nanoconstruction delivers a high reversible capacity of 297.5 and 205.5 mAh g–1 at 5 and 10 A g–1 after 2000 cycles, respectively, and a superior rate performance of 371.6 mAh g–1 at even 20 A g–1.