Change Qualification Framework in Semiconductor Manufacturing

Dass, Sasitharan Nair; Feng, Chin Jeng

doi:10.1109/tsm.2021.3125032

Cited by 3 publications

(1 citation statement)

References 17 publications

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“…Due to the high requirements on semiconductor processes and their complex interdependencies, changes to design or process—appearing small on first sight—can turn out to have tremendous effects. To protect production against imprudent consequences, changes are managed in a change request system [ 47 , 88 ]. A change request, formalizing the proposed changes and analyzing its consequences, is distributed to systematically capture all relevant factors and risks.…”

Section: Methodsmentioning

confidence: 99%

What MEMS Research and Development Can Learn from a Production Environment

Niekiel

Meyer

Lewitz

et al. 2023

Sensors

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The intricate interdependency of device design and fabrication process complicates the development of microelectromechanical systems (MEMS). Commercial pressure has motivated industry to implement various tools and methods to overcome challenges and facilitate volume production. By now, these are only hesitantly being picked up and implemented in academic research. In this perspective, the applicability of these methods to research-focused MEMS development is investigated. It is found that even in the dynamics of a research endeavor, it is beneficial to adapt and apply tools and methods deduced from volume production. The key step is to change the perspective from fabricating devices to developing, maintaining and advancing the fabrication process. Tools and methods are introduced and discussed, using the development of magnetoelectric MEMS sensors within a collaborative research project as an illustrative example. This perspective provides both guidance to newcomers as well as inspiration to the well-versed experts.

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Section: Methodsmentioning

confidence: 99%

What MEMS Research and Development Can Learn from a Production Environment

Niekiel

Meyer

Lewitz

et al. 2023

Sensors

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Knowledge-enhanced multidimensional estimation of distribution hyper-heuristic evolutionary algorithm for semiconductor final testing scheduling problem

Zhang,

Qiu,

Qian

et al. 2025

Expert Systems with Applications

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A Novel Out-of-Control Action Plan (OCAP) for Optimizing Efficiency and Quality in the Wafer Probing Process for Semiconductor Manufacturing

Yeo,

Chang,

Chen

et al. 2024

Sensors

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The out-of-control action plan (OCAP) is crucial in the wafer probing process of semiconductor manufacturing as it systematically addresses and corrects deviations, ensuring the high quality and reliability of semiconductor devices. However, the traditional OCAP involves many redundant and complicated processes after failures occur on production lines, which can delay production and escalate costs. To overcome the traditional OCAP’s limitations, this paper proposes a novel OCAP aimed at enhancing the wafer probing process in semiconductor manufacturing. The proposed OCAP integrates proactive measures such as preventive maintenance and advanced monitoring technologies, which are tested and verified through a comprehensive experimental setup. Implementing the novel OCAP in a case company’s production line reduced machine downtime by over 24 h per week and increased wafer production by about 23 wafers per week. Additionally, probe test yield improved by an average of 1.1%, demonstrating the effectiveness of the proposed method. This paper not only explores the implementation of the novel OCAP but also compares it with the traditional OCAP, highlighting significant improvements in efficiency and production output. The results underscore the potential of advanced OCAP to enhance manufacturing processes by reducing dependency on human judgment, thus lowering the likelihood of errors and improving overall equipment effectiveness (OEE).

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Change Qualification Framework in Semiconductor Manufacturing

Cited by 3 publications

References 17 publications

What MEMS Research and Development Can Learn from a Production Environment

What MEMS Research and Development Can Learn from a Production Environment

Knowledge-enhanced multidimensional estimation of distribution hyper-heuristic evolutionary algorithm for semiconductor final testing scheduling problem

A Novel Out-of-Control Action Plan (OCAP) for Optimizing Efficiency and Quality in the Wafer Probing Process for Semiconductor Manufacturing

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