Advances in Patterning Materials and Processes XXXVII 2020
DOI: 10.1117/12.2552140
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Challenges and opportunities of KrF photoresist development for 3D NAND application

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“…As well known, the thick photoresist (PR) plays an important role in forming the staircase patterns of control gate in 3D NAND [20]- [22]. To be specific, the coating of thick PR is followed by the depositions of SiO 2 and Si 3 N 4 (ON) multilayers on Si wafers.…”
Section: Introductionmentioning
confidence: 99%
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“…As well known, the thick photoresist (PR) plays an important role in forming the staircase patterns of control gate in 3D NAND [20]- [22]. To be specific, the coating of thick PR is followed by the depositions of SiO 2 and Si 3 N 4 (ON) multilayers on Si wafers.…”
Section: Introductionmentioning
confidence: 99%
“…Iwamoto [21] studied the issues of film transparency as well as film cracking and delamination of thick PR. By using a multi-focus exposure within a single scan, Canon company has introduced a Scan Flex method to improve the sidewall profile of thick PR [22]. In our previous study, we proposed both a PR consume model and a staircase scheme to improve the process efficiency and to reduce the cost [10].…”
Section: Introductionmentioning
confidence: 99%