CFD simulation studies and experimental validation on a parallel plate heat sink

Arularasan, R.; Dhanushkodi, Ganesan; Velraj, R.

doi:10.1504/ijcaet.2011.042361

Cited by 4 publications

(3 citation statements)

References 7 publications

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“…CFD has an important role in analyzing the temperature and heat transfer coefficient from the surface of the heat sink and also the residence time between the air and the extended surface is very much important for heat transfer [2]. Arularasan R et al, (2008) reported on CFD analysis in a heat sink for cooling of electronic devices that by minimized the number of fins, increased the fin pitches and the air velocity for reducing the thermal resistance and pressure drop. And it is proved that fin height as 48mm, fin thickness as 1.6mm, base height as 8mm and fin pitch as 4mm has very less pressure drop and thermal resistance [3].…”

Section: Introductionmentioning

confidence: 99%

“…Arularasan R et al, (2008) reported on CFD analysis in a heat sink for cooling of electronic devices that by minimized the number of fins, increased the fin pitches and the air velocity for reducing the thermal resistance and pressure drop. And it is proved that fin height as 48mm, fin thickness as 1.6mm, base height as 8mm and fin pitch as 4mm has very less pressure drop and thermal resistance [3]. Lakshmi Anusha et al, (2014) reported on CFD analysis of splayed pin fin heat sink using advanced composite materials that the splayed fins are more capable for the sense of L-junction temperature and also the system's total weight has been reduced by using the sophisticated materials like Polyphenylene Sulphide (PPS), Carbon Foam and Graphite Epoxy [4].…”

Section: Introductionmentioning

confidence: 99%

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Heat Transfer Analysis of Extruded Rectangular Fin over Conventional Rectangular Fins by Numerical Simulation

Sivaraja¹,

Balakumar²,

Sudha³

et al. 2015

AMM

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Improving the performance of the computers and maintaining the operating temperature is an important task for the computer hardware manufacturers. The junction temperature of the electronic components is a critical problem which needs to be addressed in a competent way. Due to the improvement in the technology, the size and weight of the electronic components reduced to a greater extent and which in turn increases the operating power and speed. This increases the heat generated by the electronic component. Electronic components normally use conventional rectangular fin as heat sink for the step up in heat transfer. The need is to make a heat sink design that should overcome the problem related to transfer of heat by the electronic components. The heat transfer depends on parameters like heat sink’s surface area, pitch, design and material used. Optimization of the fin design by number of experiments is more expensive and laborious as well. CFD (Computational Fluid Dynamics) simulation validated with experimentation can be a good alternative for performing series of experiments. CFD modeling and simulation for the best fin design has been carried out for the current study. An alternative design for conventional rectangular fin has been proposed for this study called as Extruded Rectangular Fin (ERF). The proposed ERF shows good heat transfer when compared to conventional and interrupted rectangular fin with holes. Optimum cooling achieved for the system with the fin aspect ratio of 3.5.

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Section: Introductionmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

Heat Transfer Analysis of Extruded Rectangular Fin over Conventional Rectangular Fins by Numerical Simulation

Sivaraja¹,

Balakumar²,

Sudha³

et al. 2015

AMM

View full text Add to dashboard Cite

show abstract

“…The choice of an optimal heat sink depends on a number of geometric parameters such as fin height, length, thickness, number, base plate thickness, space between fins, fin shape or profile, material, etc. To reduce cost and time, simulation method can be used to find out the best parameter, the result form simulation is verified by experimental data [3].…”

Section: Introductionmentioning

confidence: 99%

Simulation Research on the Heat Dissipation Performance of a High Power LED Radiator

Jiang

Guo

2012

AMM

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Applied in illumination area, high power LED (Light Emitting Diode) has a series of advantages with energy saving, environment-friendly, long life span, etc. However, the heat dissipation of the LED is a bottleneck in its development, and has become a key point which must be studied and solved urgently. In this paper, a typical LED lamp is modeled and thermal analysis has been performed using the software of Ansys.

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Impact of fluid-mover characteristics on heat exchanger performance: A new reality-based analysis approach

Gorman

Sparrow

Minkowycz

2015

International Journal of Heat and Mass Transfer

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CFD simulation studies and experimental validation on a parallel plate heat sink

Cited by 4 publications

References 7 publications

Heat Transfer Analysis of Extruded Rectangular Fin over Conventional Rectangular Fins by Numerical Simulation

Heat Transfer Analysis of Extruded Rectangular Fin over Conventional Rectangular Fins by Numerical Simulation

Simulation Research on the Heat Dissipation Performance of a High Power LED Radiator

Impact of fluid-mover characteristics on heat exchanger performance: A new reality-based analysis approach

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