CFD-based iterative methodology for modeling natural convection in microelectronic packages

Touré, Mamadou Kabirou; Souare, Papa Momar; Allard, S.; Foisy, Benoit; Duchesne, Éric; Sylvestre, Julien

doi:10.1109/eurosime.2018.8369862

Cited by 6 publications

(4 citation statements)

References 12 publications

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“…In our previous studies [10] [11], we have shown that in natural convection most of the heat flow passes through the PCB. The vias in the substrate dielectric layers act as thermal bridges between the substrate and the PCB.…”

Section: Resultsmentioning

confidence: 99%

“…The resolution of the energy equation was done in our model in conjunction with the k-ε turbulent model derived from the Navier-Stokes equations [19]. For more details on numerical models and hypotheses, see reference [10].…”

Section: Fvm Modelmentioning

confidence: 99%

“…The objective of this study was to perform a sensitivity analysis on our coupled (conjugate) methodology between a highly accurate conduction model and a computational fluid dynamics (CFD) model, which was reported in [10] [11] to be highly accurate when compared to temperature measurements on actual hardware. The sensitivity analysis was performed using a one-factor-at-a-time approach to evaluate the influence of model features or parameter values on the accuracy of the simulation results.…”

Section: Introductionmentioning

confidence: 99%

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Best Practices for Thermal Modeling in Microelectronics with Natural Convection Cooling: Sensitivity Analysis

Touré¹,

Souare²,

Sylvestre³

2021

JECTC

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A detailed sensitivity study was carried out on various key parameters from a high precision numerical model of a microelectronic package cooled by natural convection, to provide rules for the thermal modeling of microelectronic packages subjected to natural convection heat transfer. An accurate estimate of the junction temperature, with an error of less than 1˚C, was obtained compared to the experimental data for the vertical and horizontal orientations of the test vehicle in the JEDEC Still Air configuration. The sensitivity study showed that to have an accurate estimate of the temperature, the following elements should be present in the thermal model: radiation heat transfer in natural convection cooling; a computational fluid dynamics analysis to find realistic convection coefficients; detailed models of the high conductivity elements in the direction of the heat flow towards the environment; and finally precise values for the thicknesses of layers and the thermal properties of the substrate and the printed circuit board.

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Section: Resultsmentioning

confidence: 99%

Section: Fvm Modelmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

See 1 more Smart Citation

Best Practices for Thermal Modeling in Microelectronics with Natural Convection Cooling: Sensitivity Analysis

Touré¹,

Souare²,

Sylvestre³

2021

JECTC

Self Cite

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“…To create the parametric numerical models efficiently, a custom software was used, PACK [42] . PACK is a Python-based high performance numerical software, incorporating advanced pre-and postprocessing features for multiple commercial finite element softwares (including Ansys APDL used in this work) [43]. The chip-corner models were generated by PACK (c.f.…”

Section: Modelingmentioning

confidence: 99%

Using Confocal Microscopy and Digital Image Correlation to Measure Local Strains Around a Chip Corner and a Crack Front

Yang

Souare

Sylvestre

2020

IEEE Trans. Device Mater. Relib.

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In a flip chip package, the chip corner areas which are embedded in the underfill material are often critical to the damage initiation, since a stress concentration usually exists at these locations. A high level of stress concentration often promotes crack initiation from the chip corner. In order to better understand the local deformation around chip corners and crack tips, a method based on laser scanning confocal microscopy combined with the digital image correlation (confocal-DIC) was developed to measure local strain directly in deformed, transparent objects. A transparent epoxy resin with alumina particle fillers was used in four different types of samples, which were fabricated for the purpose of validation. A non-constrained sample and a thin-layer sample were used to verify the isotropic thermal expansion and the strain gradients with respect to the depth, respectively. Results from both samples were in good agreements with the calculation from the coefficient of thermal expansion (CTE) and FEM simulations. Furthermore, the confocal-DIC technique was applied to measure the strain distribution near the chip corner area of a third sample replicating the geometry of a flip chip package. The measured maximum first principal strain was located at the chip corner, reaching 0.9 % at 60 °C, in a good agreement with the simulation results. The strain in front of the crack tip was also evaluated by a three-point bending test in a fourth test sample. The measured maximum strain was 5.8±0.7 %, corresponding to a relative error of only about 5 % compared to simulations for a round crack tip configuration. The averaging used in DIC lowers its spatial resolution and makes it difficult to capture higher strain gradients in small regions. However, the confocal-DIC approach appears to be able to provide reasonable results for evaluating the maximum strain and the full field strain distribution in tri-dimensional volumes with geometries, materials and dimensions which are very similar to those of actual flip chip microelectronic packages.

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Direct Measurements of Underfill Local Strain Using Confocal Microscopy and Digital Image Correlation

Yang¹,

Souare²,

Sylvestre³

2019

2019 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and

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CFD-based iterative methodology for modeling natural convection in microelectronic packages

Cited by 6 publications

References 12 publications

Best Practices for Thermal Modeling in Microelectronics with Natural Convection Cooling: Sensitivity Analysis

Best Practices for Thermal Modeling in Microelectronics with Natural Convection Cooling: Sensitivity Analysis

Using Confocal Microscopy and Digital Image Correlation to Measure Local Strains Around a Chip Corner and a Crack Front

Direct Measurements of Underfill Local Strain Using Confocal Microscopy and Digital Image Correlation

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