Ceramic substrates for high voltage power electronics: past, present and future

Valdez-Nava, Zarel; Kenfaui, Driss; Locatelli, Marie-Laure; Laudebat, Lionel; Guillemet, Sophie

doi:10.1109/iwipp.2019.8799084

Cited by 14 publications

(6 citation statements)

References 21 publications

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“…A field grading substrate was also proposed recently in [82], where the idea is to modify the part of the substrate ceramic at the triple point with higher conductivity. Figure 13 shows the impact of this field grading method on the electric field distribution by modifying the AlN conductivity by a factor of 1×10 6 .…”

Section: Mitigation Methodsmentioning

confidence: 99%

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Insulation Materials and Systems for Power Electronics Modules: A Review Identifying Challenges and Future Research Needs

Zhang

Ghassemi

Zhang

2021

IEEE Trans. Dielect. Electr. Insul.

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This manuscript critically reviews recent research on electrical insulation materials and systems used in power electronics devices and focuses on electrical treeing in silicone gel, PD modeling, and mitigation methods. For mitigation methods, electric field grading techniques, such as 1) various geometrical techniques, and 2) applying nonlinear dielectrics are discussed. Alternatives for silicone gel, such as liquid dielectrics, are also highlighted. The drawbacks of reported research and technical gaps are identified. In particular, we show that the investigations carried out to date are in their infancy regarding the working conditions targeted for next-generation WBG power devices. This review will provide a useful framework and point of reference for future research.

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Section: Mitigation Methodsmentioning

confidence: 99%

“…Field simulations of the (a) conventional DBC structure and (b) substrate with a higher conductivity in region B[82], © [2019] IEEE.…”

mentioning

confidence: 99%

Insulation Materials and Systems for Power Electronics Modules: A Review Identifying Challenges and Future Research Needs

Zhang

Ghassemi

Zhang

2021

IEEE Trans. Dielect. Electr. Insul.

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“…Some other methods of modifying geometric parameters of DBC substrates are also easy to implement in real modules, but with little effects on the electric field strength because for a given ceramic thickness the voltage stress across the ceramic is a key contribution to the electrical field at the triple point. Some novel DBC substrates could significantly reduce the maximum electric field, such as the protruding substrate [21] and the mesa substrate [22,23], but these technologies are currently difficult to implement in real power modules. Field grading substrate was first proposed by Z. Valdez-Nava directly integrated a new region with different dielectric properties into the basic ceramic substrate [23].…”

Section: State Of the Electric Field Managementmentioning

confidence: 99%

“…Some novel DBC substrates could significantly reduce the maximum electric field, such as the protruding substrate [21] and the mesa substrate [22,23], but these technologies are currently difficult to implement in real power modules. Field grading substrate was first proposed by Z. Valdez-Nava directly integrated a new region with different dielectric properties into the basic ceramic substrate [23]. However, at present, this technology has not yet been achieved, and there are no achievable samples.…”

Section: State Of the Electric Field Managementmentioning

confidence: 99%

“…This contradicts the compact volume design of the power module. Some other novel modifications of ceramic substrates have also been proposed to control the electric field, such as protruding substrate [19], mesa structure at the ceramic [22,23], and 3D module layout [24]. However, these structures require complicated processing techniques, which is not feasible in the current fabrication process.…”

Section: Introductionmentioning

confidence: 99%

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Mitigation measures of the electric field in the medium‐voltage power module: Effect of voltage types and recommendations for designers

et al. 2021

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In the medium‐voltage silicon carbide device power module, the higher voltage level will induce higher electric field stress in critical internal points such as the edge of the conductor on the direct bonded copper (DBC) substrate. This can lead to partial discharge and subsequently accelerated ageing of the insulating medium in the module. Therefore, it is important to reduce the high electric field strength. Herein, the related technical methods of electric field control are reviewed and compared by combining the ease of implementation in real power module and the field control effect. In addition, systematic explanations of the electric field drift and influencing factors of the electric field strength under different voltage types within different module structures are presented. Finally, for half‐bridge power modules with different substrates structures, suggestions on how to implement non‐linear field‐dependent materials to reduce the electric field strength are given.

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