CCGA packages for space applications

Ghaffarian, Reza

doi:10.1016/j.microrel.2006.07.094

Cited by 75 publications

(26 citation statements)

References 1 publication

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“…An extensive study on thermomechanically loaded ceramic CGA (CCGA) packages tested in harsh test conditions was published recently. 7 The column materials used in CCGA packages are either 90Pb-10Sn alloy or copper. High-lead 90Pb-10Sn columns are currently exempted from Restriction of Hazardous Substances (RoHS) legislation and, therefore, they can be used in lead-free assemblies.…”

Section: Introductionmentioning

confidence: 99%

Thermal Fatigue Endurance of Lead-Free Composite Solder Joints over a Temperature Range of −55°C to 150°C

Nousiainen

Kangasvieri

Rautioaho

et al. 2009

Journal of Elec Materi

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The thermal fatigue endurance of two lead-free solder/plastic-core solder ball (PCSB) composite joint structures in low-temperature co-fired ceramic (LTCC) modules was investigated using a thermal cycling test over a temperature range of À55°C to 150°C. The investigated solder alloys were Sn-7In-4.1Ag-0.5Cu (SAC-In) and 95.5Sn-4Ag-0.5Cu (SAC). Three failure mechanisms were observed in the test joints. Transgranular (fatigue) cracking mixed with minor intergranular cracking was the dominant failure mechanism at the outer edge of the joints in both test assemblies, whereas separation of the solder/intermetallic compound (IMC) interface and creep cracking occurred in the other parts of the test joints. The propagation rate of the transgranular crack was lower in the SAC-In joints compared with in the SAC joints. Furthermore, the SAC solder seemed to be more prone to separation of the solder/IMC interface, and more severe intergranular (creep) cracking occurred in it compared with in the SAC-In solder. In the thermal cycling test conditions, the better thermal fatigue endurance of the SAC-In solder composite joints resulted in a 75% higher characteristic lifetime compared with the SAC composite joints.

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Section: Introductionmentioning

confidence: 99%

Thermal Fatigue Endurance of Lead-Free Composite Solder Joints over a Temperature Range of −55°C to 150°C

Nousiainen

Kangasvieri

Rautioaho

et al. 2009

Journal of Elec Materi

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“…Recent advances in EAs and SI show that the introduction of ecological models and cooperative architectures are effective methods to broaden the use of traditional EAs and SI algorithms (van den Bergh and Engelbrecht, 2004;Potter and de Jong, 2000;Li and Yao, 2012;Mohammed and Mohamed, 2005;Ghaffarian, 2006;Bergh and Engelbrecht, 2004). In particular, multiple population cooperative techniques provide an effective means of handling large and complex problems via a divide-and-conquer strategy.…”

Section: Multiple Population Cooperative Mechanismmentioning

confidence: 99%

Cooperative artificial bee colony algorithm for multi-objective RFID network planning

Zhu

et al. 2014

Journal of Network and Computer Applications

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“…Recent advances in EA and SI show that the introduction of ecological models and cooperative architectures are effective methods to broaden the use of traditional EA and SI algorithms [48][49][50][51][52]. In particular, multiple population cooperative techniques provide an effective means of handling large and complex problems via a divide-and-conquer strategy.…”

Section: Multiple Hive Cooperative Mechanismmentioning

confidence: 99%

Multi-hive bee foraging algorithm for multi-objective optimal power flow considering the cost, loss, and emission

Chen

Zhu

2014

International Journal of Electrical Power & Energy Systems

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CCGA packages for space applications

Cited by 75 publications

References 1 publication

Thermal Fatigue Endurance of Lead-Free Composite Solder Joints over a Temperature Range of −55°C to 150°C

Thermal Fatigue Endurance of Lead-Free Composite Solder Joints over a Temperature Range of −55°C to 150°C

Cooperative artificial bee colony algorithm for multi-objective RFID network planning

Multi-hive bee foraging algorithm for multi-objective optimal power flow considering the cost, loss, and emission

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