Cationic Dyes

Gurr, Edward

doi:10.1016/b978-0-12-309650-0.50007-7

Cited by 9 publications

(9 citation statements)

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“…Therefore, C 22 H 21 N 3 Na 2 O 9 S 3 can be taken as the formula of the unknown dye, giving a molecular mass of 613 u. In fact, in the literature it is reported that Acid Fuchsin can derive as a sulfonated form from basic fuchsin or from the single dyes (rosaniline, pararosaniline and new fuchsin) of which the latter is a mixture [41] . Of the three individual dyes, the trimethylated form is new fuchsin, also known as Magenta III.…”

Section: Resultsmentioning

confidence: 99%

Early synthetic textile dyes of the late 19th century from the “Primo Levi” Chemistry Museum (Rome): A multi-technique analytical investigation

Longoni¹,

Gavazzi²,

Monti³

et al. 2023

Journal of Cultural Heritage

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Section: Resultsmentioning

confidence: 99%

Early synthetic textile dyes of the late 19th century from the “Primo Levi” Chemistry Museum (Rome): A multi-technique analytical investigation

Longoni¹,

Gavazzi²,

Monti³

et al. 2023

Journal of Cultural Heritage

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“…Calcien is not really a dye but an acid flurochrome that is made by introducing two methyliminodiacetic acid groups into a fluorescein molecule. 23 Its strongest and peak emission is at 500 nm, and its peak absorbance spectra occurs at 490 nm at 25°C when excited by a 350 nm light source. To take advantage of the type II error associated with these dyes to measure film thickness, fluorescence is filtered at 455 to 500 nm to look at the same bandwidth at which coumarin fluoresces and calcien absorbs.…”

Section: Methodsmentioning

confidence: 99%

Measurements of Slurry Film Thickness and Wafer Drag during CMP

Rogers

Manno

et al. 2004

J. Electrochem. Soc.

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Chemical mechanical planarization ͑CMP͒ is a process widely used for the manufacture of silicon integrated circuits. In this work, we measured the thickness of the slurry film between the wafer and the pad during polish while simultaneously measuring the frictional drag. All experiments are performed on a 1:2 scale laboratory tabletop rotary polisher with variable pad speed and wafer downforce control. Dual emission laser-induced fluorescence techniques optically measured the slurry film thickness through a dual-camera imaging system. The resulting data are discussed for wafers polished with a 3.1 wt % abrasive concentration slurry solution on Freudenberg's FX-9 polishing pads. It was found that the degree of surface curvature of the wafer substrate significantly influences the slurry film thickness and wafer drag, and therefore, the polish. The convex wafer shows the expected behavior of increased downforce reduces the slurry film thickness and increases the coefficient of friction. Further, as the pad speeds up, the slurry thickness increases and the friction decreases. The concave wafer shows no change in slurry film thickness and a decrease in the frictional coefficient with increasing downforce. Both the film thickness and frictional coefficient appear to decrease slightly with increasing pad speed. This difference between the two wafer shapes reflects the different fluid mechanics in each case.The chemical mechanical planarization ͑CMP͒ process is generally accepted as the technique used for the manufacture of integrated circuits ͑ICs͒, yet the understanding of the fundamental mechanisms involved in this process is limited. In recent years fundamental research has been done to both experimentally understand polishing characteristics and analytically model the processes involved. 1-3 To model the removal rate, one must first understand how the thin ͑ϳ20 m͒ film of slurry between the wafer and polishing pad behaves. Thin-film thicknesses also imply that the asperities in the pad reach through the slurry and rub on the pad. Wafer nonuniformities in turn lead to defects during production. Slurry film thickness during polishing is largely determined by how the hydrodynamic pressure of the fluid and the pad asperities support the wafer downforce. Levert, Mess, and Tichy have found that during polishing there is a vacuum created underneath a static wafer, pulling the wafer into the pad. 4-6 Sundararajan has found positive fluid pressure developing in the gap between the wafer and polishing pad. 7 In our experiments we witness both cases: positive pressure with a convex wafer ͑Fig. 1a͒ and negative pressure ͑vacuum͒ with a concave wafer ͑Fig. 1b͒. Frictional measurements during polishing help characterize the interaction between the wafer, abrasive ͑slurry͒, and pad. 8 This in turn helps identify the removal rate and its dependence on the lubrication regime. 3,[9][10][11][12] The separation distance between the polishing pad and the wafer substrate during CMP can be characterized by the thickness of the slurry laye...

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“…Apart from that, it is also used in printing, biological staining, radiopaque medium, etc. (20)(21)(22). The second dye is metanil yellow which is an azo dye and normally used as a pH indicator.…”

Section: Introductionmentioning

confidence: 99%

Dyes degradation using atmospheric pressure dielectric barrier discharge pencil plasma jet

Rathore

Pandey²,

Patel³

et al. 2023

Preprint

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The dye degradation efficacy of the cold plasma pencil jet is presented in the present investigation. Air plasma is produced in the cylindrical coaxial dielectric barrier discharge configuration. Electrical characterization of plasma is performed and the plasma species are identified using optical emission spectroscopy. For the dye degradation study using air plasma, six different types of dyes (erythrosine, metanil yellow, sudan I, crystal violet, rhodamine B, and Indigo) are chosen. The degradation of dyes is analyzed using UV visible spectroscopy, total organic carbon, and chemical oxygen demand. The results showed complete degradation of all the dyes in UV visible analysis with minimum time for indigo (3 minutes) and maximum time for erythrosine (45 minutes). Moreover, erythrosine (k = 1.08 mg L-1 min-1) and sudan I (k= 3.46 mg L-1 min-1) follows zero-order degradation kinetic and metanil yellow (k = 0.094 min-1), crystal violet (k = 0.25 min-1), rhodamine B (k = 0.17 min-1), Indigo (k = 0.81 min-1) follows first-order degradation kinetics. Also, substantial enhancement in mineralization and reduction in chemical oxygen demand of all the dyes occurs after plasma treatment. The toxicity of plasma degraded dye solution toward freshwater algae species (Chlorella Sorokiniana and Chlorella Pyrenoidosa) are significantly low compared to virgin dyes solutions. The study reveals that pencil plasma jet substantially degrade dyes as well as converts the dyes solutions non-toxic.

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Cationic Dyes

Cited by 9 publications

References 0 publications

Early synthetic textile dyes of the late 19th century from the “Primo Levi” Chemistry Museum (Rome): A multi-technique analytical investigation

Early synthetic textile dyes of the late 19th century from the “Primo Levi” Chemistry Museum (Rome): A multi-technique analytical investigation

Measurements of Slurry Film Thickness and Wafer Drag during CMP

Dyes degradation using atmospheric pressure dielectric barrier discharge pencil plasma jet

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