“…Our results for the pit size and its correspondence with the Burgers vector conflict with the size ranking of screw>mixed>edge in some publications where only KOH or a mixture of KOH and NaOH was used. 14,16,19,57,58 The geometric features of etch pits in our study are also different from those formed by KOH 54 or HCl gas. 28 In these reports, the etch pits corresponding to TMDs have two-step facets, which appear as a combination of triangular and trapezoidal shapes when viewed along the cross-sectional direction.…”
Section: Dislocations Under L-pitscontrasting
confidence: 58%
“…Atomic force microscopy (AFM) measurements showed that the as-grown surface was covered with atomic steps, which indicates a two-dimensional (2D) stepflow growth. The HVPE-grown layer was nominally undoped, and the impurity concentrations as measured from secondary ion mass spectrometry (SIMS) were [C]=2×10 16 cm -3 , [O]=3×10 16 cm -3 , and [Si]=5×10 15 cm -3 .…”
Section: Fs-gan Substrates Prepared With Hvpementioning
confidence: 99%
“…Meissner et al 16 studied an Fe-doped FS-GaN layer and Sidoped GaN films grown via HVPE using CL and the etch pit method. They confirmed a one-to-one correlation between the CL dark spots and the etch pits, but there was no direct relationship between the pit size and the contrast of the respective dark spot.…”
Section: Dislocations Under L-pitsmentioning
confidence: 99%
“…Henceforth, we refer to the 1a, 1c, and a+c dislocations as TED, TSD, and TMD, respectively, unless specified otherwise. The TDs have deleterious effects on the performance and lifetime of GaN-based devices through mechanisms such as carrier scattering, 9,10 carrier trapping via nonradiative recombination (NRR), [11][12][13][14][15][16] and paths for leakage current. [17][18][19][20][21][22] These different mechanisms are connected by the fact that dislocations act as one-dimensional (1D) charged defects that introduce electronic states into the energy gap.…”
Correlations between the structural properties and nonradiative recombination (NRR) behaviors of threading dislocations in freestanding hydride-vapor-phase-epitaxy (HVPE) GaN substrates were investigated using cathodoluminescence (CL), the etch pit method, transmission electron...
“…Our results for the pit size and its correspondence with the Burgers vector conflict with the size ranking of screw>mixed>edge in some publications where only KOH or a mixture of KOH and NaOH was used. 14,16,19,57,58 The geometric features of etch pits in our study are also different from those formed by KOH 54 or HCl gas. 28 In these reports, the etch pits corresponding to TMDs have two-step facets, which appear as a combination of triangular and trapezoidal shapes when viewed along the cross-sectional direction.…”
Section: Dislocations Under L-pitscontrasting
confidence: 58%
“…Atomic force microscopy (AFM) measurements showed that the as-grown surface was covered with atomic steps, which indicates a two-dimensional (2D) stepflow growth. The HVPE-grown layer was nominally undoped, and the impurity concentrations as measured from secondary ion mass spectrometry (SIMS) were [C]=2×10 16 cm -3 , [O]=3×10 16 cm -3 , and [Si]=5×10 15 cm -3 .…”
Section: Fs-gan Substrates Prepared With Hvpementioning
confidence: 99%
“…Meissner et al 16 studied an Fe-doped FS-GaN layer and Sidoped GaN films grown via HVPE using CL and the etch pit method. They confirmed a one-to-one correlation between the CL dark spots and the etch pits, but there was no direct relationship between the pit size and the contrast of the respective dark spot.…”
Section: Dislocations Under L-pitsmentioning
confidence: 99%
“…Henceforth, we refer to the 1a, 1c, and a+c dislocations as TED, TSD, and TMD, respectively, unless specified otherwise. The TDs have deleterious effects on the performance and lifetime of GaN-based devices through mechanisms such as carrier scattering, 9,10 carrier trapping via nonradiative recombination (NRR), [11][12][13][14][15][16] and paths for leakage current. [17][18][19][20][21][22] These different mechanisms are connected by the fact that dislocations act as one-dimensional (1D) charged defects that introduce electronic states into the energy gap.…”
Correlations between the structural properties and nonradiative recombination (NRR) behaviors of threading dislocations in freestanding hydride-vapor-phase-epitaxy (HVPE) GaN substrates were investigated using cathodoluminescence (CL), the etch pit method, transmission electron...
“…High‐AlN mole fraction AlGaN without AlN regrowth was also determined from the CL measurement results, in which the dark spot density related to the dislocations was calculated to be 1.23 × 10 9 cm −2 . In the calculation of dislocation density, the number of dark spots of CL‐image considered to be due to dislocation was counted and the density per area was calculated …”
We investigated the fabrication and characterization of AlN and AlGaN epilayers grown on sputtered and annealed AlN/sapphire templates by metal organic vapor phase epitaxy. The surfaces of the AlN homoepilayers exhibited clear step‐terrace structures with minimal root mean square roughness values. X‐ray rocking curve (XRC) measurements showed that the AlN homoepilayers had smaller (101¯2)‐plane full width at half maximum (FWHM) values (192 arcsec) than the AlN/sapphire templates did (214 arcsec), and that they had larger (0002)‐plane FWHM values (97 arcsec) than the AlN/sapphire templates (22 arcsec). The latter results may be due to the wafer curvature increasing as the AlN layer thickness increases. We also present results for the growth of AlGaN heteroepilayers with different AlN compositions on AlN/sapphire templates that either did or did not contain AlN regrowth layers. High‐AlN mole fraction AlGaN heteroepilayers had larger (0002)‐plane FWHM values and smaller (101¯2)‐plane FWHM values than low‐AlN mole fraction AlGaN. Furthermore, the presence of an AlN regrowth layer tended to have a negative effect on the high‐AlN mole fraction AlGaN layers. The above results are discussed using lattice mismatch, wafer curvature, surface condition, and growth temperature parameters.
This article describes the historic development of the Erlangen Crystal GrowthLaboratory CGL from its beginnings in 1974 at the chair of Materials of Electrical Engineering (Department of Material Science) of the University of Erlangen-Nuremberg until its current status as a large department "Materials" of the Erlangen Fraunhofer-Institute for Integrated Systems and Device Technology. Essential developments and scientific achievements in the various fields of crystal growth and epitaxy are presented from the early period until today.
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