Case Study of a DDR Loopback Test Failure Encountered on a Map Ball Grid Array Packaged Device

García, José Z.; Dickson, Kris

doi:10.31399/asm.cp.istfa2017p0303

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A Security Threats Of Counterfeit Semiconductor Devices1

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“…Moreover, counterfeits are clandestine and discrete in nature; bringing another type of attack closer to reality, malicious implanted attacks that are known as Trojans [5]. It is possible that one could potentially open and refill packaging material or repackage the entire die with minimum sign of suspicion under optical inspection [6], [7]. This all can be seen below in Fig.…”

Section: A Security Threats Of Counterfeit Semiconductor Devicesmentioning

confidence: 99%

Scanning Acoustic Microscopy Package Fingerprint Extraction for Integrated Circuit Hardware Assurance

Johnson

Hsu

et al. 2021

International Symposium for Testing and Failure Analysis

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The supply chain of the semiconductor industry is experiencing painful growth and advancement in chip development with the help of recently passed U.S legislation and funding to address a chip shortage. However, it is not without some drawbacks, one of which is the challenge of maintaining control over the manufacturing quality throughout the entire process. As a result of this, physical inspection for hardware security is a necessity to assure the semiconductor devices. In this paper, various physical inspection methods are reviewed and scanning acoustic microscopy (SAM) is proved to be the ideal physical inspection method to minimize the possibility of counterfeits which might be the feasible solution in detecting counterfeits on a large scale.

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Section: A Security Threats Of Counterfeit Semiconductor Devicesmentioning

confidence: 99%