Boiling can transfer a vast amount of heat and thereby
is widely
used for cooling advanced systems with high power density. However,
the capillary force of most existing wicks is insufficient to surpass
the liquid replenishing resistance for high-efficient boiling. Herein,
we report a new microgroove wick on high-conductive copper substrates
that was constructed via ultraviolet nanosecond pulsed laser milling.
The phase explosion, combined with melting and resolidification effects
of laser milling induces dense microcavities with sizes around several
micrometers on the microgroove surface. The hierarchical microstructures
significantly improve the wettability of the microgroove wicks to
obtain strong capillary and meanwhile provide abundant effective nucleation
sites. The boiling heat transfer in a visualized flat heat pipe shows
that the new wicks enable sustainable liquid replenishing even under
antigravity conditions, thus resulting in maximum 33-fold improvement
of equivalent thermal conductivity when compared with the copper base.
This research provides both scientific and technical bases for the
design and manufacture of high-performance phase change cooling devices.