2008
DOI: 10.1016/j.cie.2008.02.006
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Capacity pricing mechanism for wafer fabrication

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Cited by 2 publications
(1 citation statement)
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“…In wafer fabrication, hundreds of machines operate together under various constraints and procedures to construct multiple layers of chemical patterns on a silicon wafer (Kumar 1994;Mason et al 2002). The initial layers after release are basic operations for all types of wafers, and several layers, including poly and metal operations, can be distinctly identified based on product specification (Chung et al 2008). Every layer should be processed in a similar manner.…”
Section: Introductionmentioning
confidence: 99%
“…In wafer fabrication, hundreds of machines operate together under various constraints and procedures to construct multiple layers of chemical patterns on a silicon wafer (Kumar 1994;Mason et al 2002). The initial layers after release are basic operations for all types of wafers, and several layers, including poly and metal operations, can be distinctly identified based on product specification (Chung et al 2008). Every layer should be processed in a similar manner.…”
Section: Introductionmentioning
confidence: 99%