Cantilever-Type Microelectromechanical Systems Probe Card with Through-Wafer Interconnects for Fine Pitch and High-Speed Testing

Kim, Bong-Hwan; Kim, Hyun-Chul; Chun, Kukjin; Ki, JungHee; Tak, Yongsug

doi:10.1143/jjap.43.3877

Cited by 32 publications

(20 citation statements)

References 10 publications

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“…4(d)]. A submicrometer-thick Ti film was then deposited by thermal evaporation as an adhesive layer and used as a seed layer because it has a large residual For the fabrication of each probe electrode, the throughsilicon via technique with inductively coupled plasma dry etching and electroplating process have been used by many studies to accomplish the interconnections embedded in the silicon substrate [14]- [16], and laser scribing has also been used to achieve the electrical separation of the electroplated Ni layer [10], in which the through-silicon via and electroplating process achieve a fine pitch and high-density multiarray interconnections with greater electrical performance and the laser machining offers great performance at low cost and a high yield. The minimum kerf width was maintained at less than 10 μm for scribing depths of 25 μm large.…”

Section: B Fabrication Processmentioning

confidence: 99%

A Novel Micromachined Claw Probe for the Electrical Testing of Microsolder Ball

Tsou

Lai

Huang

2012

J. Microelectromech. Syst.

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This paper presents a micromachined claw probe with electroplating nickel for microsolder ball electrical testing applications. The suspension claw structure consists of two bridges and four curved cantilevers, which have a flexible spring constant in a small region. The out-of-plane claw-probe unit was fabricated using silicon bulk micromachining, titanium deposition, and nickel electroplating processes. The typical bending cantilever structure, made by nickel electroplating, had a thickness of 6.5 μm, a width of 10 μm, and a length of 80 μm. The maximum out-of-plane deflections of the fabricated 40 × 40 claw-probe array were approximately 50 ± 1.2 μm, under the effect of residual tensile stress of 923 MPa. For the probing test of the microsolder ball with a diameter of 200 μm, under the contact force of 1.75 mN, the measured path resistance was about 30 Ω, and the moving stroke of the microsolder ball was 14 μm. The extendable overdrive stroke was over 30 μm, after probe contact with the microsolder ball, and obvious damage was not observed on the surfaces of the claw probe except for several slight scrapes on the sidewall of the microsolder ball. This probe card is potentially capable of providing a very large number of micromachined probes in an array format and can also satisfy the requirements for a fine-pitch ball grid array and low-cost wafer-level testing.[ 2011-0299]Index Terms-Claw probe, electroplated nickel, microsolder ball, residual stresses.

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Section: B Fabrication Processmentioning

confidence: 99%

A Novel Micromachined Claw Probe for the Electrical Testing of Microsolder Ball

Tsou

Lai

Huang

2012

J. Microelectromech. Syst.

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“…A low resistance must be achieved by the contact area at the end of probe sliding. Kataoka et al (2003) and Kim et al (2004) have presented the Ni micro-cantilever needle made by an electroplating process, which has a lower contact-force than the conventional tungsten needle.…”

Section: Fig 1 -Epoxy Ring Probe Card For DVI Probing Test (Providedmentioning

confidence: 99%

Geometric parameter design of a cantilever probing needle used in epoxy ring probe card

Chang

2009

Journal of Materials Processing Technology

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“…A 1G probe card assembled by hand has the advantages of low cost and short-term delivery, but it is difficult to align the probes exactly. In order to reduce the alignment error and pitch of the probes, a guide block for probe alignment is added to the 1.5G probe card (Kim et al 2004a(Kim et al , b, 2007Lee and Sadrabadi 2011). In addition, the probes and guide block used in the 1.5G probe card are made by a micromachining technology.…”

Section: Introductionmentioning

confidence: 99%

Fabrication of a guide block for measuring a device with fine pitch area-arrayed solder bumps

Choi

Ryu

2012

Microsyst Technol

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This paper describes the design and fabrication of a guide block and micro probes, which were used for a vertical probe card to test a chip with area-arrayed solder bumps. The size of the fabricated guide block was 10 mm 9 6 mm. The guide block consisted of 172 holes to insert micro probes, 2 guide holes for exact alignment, and 4 holes for bolting between the guide block and the housing of a PCB. Pitch and size of the inserting holes were 80 lm, and 90 lm 9 30 lm, respectively. A silicon on insulator wafer was used as the substrate of the guide block to reduce micro probes insertion error. The micro probes were made of nickel-cobalt (Ni-Co) alloy using an electroplating method. The length and thickness of the micro probes were 910 and 20 lm, respectively. A vertical probe card assembled with the fabricated guide block and micro probes showed good x-y alignment and planarity errors within ±4 and ±3 lm, respectively. In addition, average leakage current and contact resistance were approximately 0.35 nA and 0.378 ohm, respectively. The proposed guide block and micro probes can be applied to a vertical probe card to test a chip with area-arrayed solder bumps.

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Cantilever-Type Microelectromechanical Systems Probe Card with Through-Wafer Interconnects for Fine Pitch and High-Speed Testing

Cited by 32 publications

References 10 publications

A Novel Micromachined Claw Probe for the Electrical Testing of Microsolder Ball

A Novel Micromachined Claw Probe for the Electrical Testing of Microsolder Ball

Geometric parameter design of a cantilever probing needle used in epoxy ring probe card

Fabrication of a guide block for measuring a device with fine pitch area-arrayed solder bumps

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