Calibration of micro-thermal analysis for the detection of glass transition temperatures and melting points

Fischer, Hartmut

doi:10.1007/s10973-007-8554-1

Cited by 19 publications

(13 citation statements)

References 17 publications

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“…A number of ways used to calibrate a thermal probe have been comprehensively reviewed [15][16][17] and include: isothermal (hotplate) calibration, 18 melting point standard calibration, [19][20][21]24 using the linearity of heater resistance with temperature, 25 and calibration methodology using Raman thermometry. 16 Here we use a small thermocouple of the same size as the tip to calibrate the probe.…”

Section: B Thermomechanical Analysismentioning

confidence: 99%

“…The difficulty in determining the temperature at the interface of the probe-sample has been identified by others. 17,22 Since the relation between power or resistance and temperature is dependent on substrate heat losses, all of the existing calibration methods will be somewhat affected by different samples. In order to estimate the temperature at the interface, thermal resistance circuits of the probe and sample have been developed.…”

Section: B Thermomechanical Analysismentioning

confidence: 99%

“…Thermal conduction (and contact resistance) at the interface depends on the contact area and the contact pressure. 17,29 In this work we use the force vs. displacement curve to control the contact pressure. Based on our thermal calibration method, as described below, we have experimentally measured the melting point Figure 4(a) shows the change in resistance of the deflection sensing element on the vertical axis with temperature increase of the heating element on the horizontal axis.…”

Section: B Thermomechanical Analysismentioning

confidence: 99%

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A piezo-thermal probe for thermomechanical analysis

Gaitas

Gianchandani

Zhu

2011

Review of Scientific Instruments

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Thermomechanical analysis (TMA) is widely used to characterize materials and determine transition temperatures and thermal expansion coefficients. Atomic-force microscopy (AFM) microcantilevers have been used for TMA. We have developed a micromachined probe that includes two embedded sensors: one for measuring the mechanical movement of the probe (deflection) and another for providing localized heating. The new probe reduces costs and complexity and allow for portability thereby eliminating the need for an AFM. The sensitivity of the deflection element (( R/R)/deflection) is 0.1 ppm/nm and its gauge factor is 3.24. The melting temperature of naphthalene is measured near 78.5 • C.

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Section: B Thermomechanical Analysismentioning

confidence: 99%

Section: B Thermomechanical Analysismentioning

confidence: 99%

Section: B Thermomechanical Analysismentioning

confidence: 99%

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A piezo-thermal probe for thermomechanical analysis

Gaitas

Gianchandani

Zhu

2011

Review of Scientific Instruments

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“…[1][2][3][4][5][6][7][8][9][10] Temperature calibration is required for scanning thermal microscopy, where substrate temperature changes must be measured with high accuracy. A number of ways to calibrate a scanning thermal probe have been developed 11,12 and include: isothermal (hotplate) calibration, 13 melting point standard calibration, 14,15 use of the linearity of heater resistance with temperature, 16 calibration methodologies using Raman thermometry, 11 and the use of a small thermocouple in contact with the probe. 18 Many calibration techniques measure the temperature changes of the probe while operating the probe as a heater; however, this does not account for the heat transfer effects at the substrate-tip interface during a thermal scan.…”

Section: Introductionmentioning

confidence: 99%

Hot-spot detection and calibration of a scanning thermal probe with a noise thermometry gold wire sample

Gaitas

Wolgast

Covington

et al. 2013

Journal of Applied Physics

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Measuring the temperature profile of a nanoscale sample using scanning thermal microscopy is challenging due to a scanning probe's non-uniform heating. In order to address this challenge, we have developed a calibration sample consisting of a 1-lm wide gold wire, which can be heated electrically by a small bias current. The Joule heating in the calibration sample wire is characterized using noise thermometry. A thermal probe was scanned in contact over the gold wire and measured temperature changes as small as 0.4 K, corresponding to 17 ppm changes in probe resistance. The non-uniformity of the probe's temperature profile during a typical scan necessitated the introduction of a temperature conversion factor, g, which is defined as the ratio of the average temperature change of the probe with respect to the temperature change of the substrate. The conversion factor was calculated to be 0.035 6 0.007. Finite element analysis simulations indicate a strong correlation between thermal probe sensitivity and probe tip curvature, suggesting that the sensitivity of the thermal probe can be improved by increasing the probe tip curvature, though at the expense of the spatial resolution provided by sharper tips. Simulations also indicate that a bow-tie metallization design could yield an additional 5-to 7-fold increase in sensitivity.

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“…This technique is used for calibration of, for instance, micromechanical probes for temperature measurements [118,119] or calorimetric experiments [120]. Generally, the glass transition (T g ) or melting temperature (T m ) of polymers (T m = 36-260 ºC [118,121]) or metals (T m > 156 ºC [77]) is used.…”

Section: Introduction Methods and Metrologymentioning

confidence: 99%

Nanolink-based thermal devices : integration of ALD tin thin films

Groenland¹

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Publisher: Gildeprint Drukkerijen, Enschede MS Word thesis template by Ihor BrunetsThe cover shows an optical micrograph (topview) of Greek Cross shaped four-point structures with buried electrodes (chapter 2) for the electrical characterization of ultrathin ALD TiN layers ('Dead Cow van der Pauws') during the fabrication process after wet chemical etching of the ALD TiN layer stack, showing redeposited photoresist residues of square-shaped contact chain structures (which are located outside the image).

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Calibration of micro-thermal analysis for the detection of glass transition temperatures and melting points

Cited by 19 publications

References 17 publications

A piezo-thermal probe for thermomechanical analysis

A piezo-thermal probe for thermomechanical analysis

Hot-spot detection and calibration of a scanning thermal probe with a noise thermometry gold wire sample

Nanolink-based thermal devices : integration of ALD tin thin films

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