Bump geometric deviation on the reliability of BOR WLCSP

Reliability of Wafer Level Chip Scale Packages

“…12, the cracks have been observed under the corner and edge bumps, which is typically expected since the stress is related to the distance to the neutral point [13]. Results from Finite Element Modeling (FEM) of the stress in the passivation layer are in line with the AL-TMCL results.…”