Built-in-self-test techniques for MEMS

Mir, Salvador; Rufer, Libor; Dhayni, A.

doi:10.1016/j.mejo.2006.04.016

Cited by 22 publications

(14 citation statements)

References 15 publications

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“…This reflects the fact that physical stimuli should be generated in the integrated circuit and analysis or preprocessing of the results should be done inside the IC, resulting in additional cost for the device [10]. One of the methods used to generate stimuli is through emulation of mechanical stimuli using electrical stimuli and taking advantage of electrostatic forces [11]. An example of this emulation is the application of impulsive electrical signals in accelerometers to generate a displacement of the inertial mass, Fig.…”

Section: B Failure Detectionmentioning

confidence: 99%

A Comparison of Neural Networks to Detect Failures in Micro-electro-mechanical Systems

Angel

Higuera

Bernal

et al. 2010

2010 IEEE Electronics, Robotics and Automotive Mechanics Conference

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The development of microelectronic industry has been related with the development of methodologies for detection of faults, either in production lines or in the field of action of devices. This has not happened in the industry of micro electromechanical systems (MEMS), which have made great progress in developing device but the fault detection techniques have been inherited the microelectronic. This presents a major problem since the nature of failures in MEMS is radically different from microelectronic failure. Given the complexity of fault modeling MEMS multiphysics propose the use of neural networks as classifier system failures that could be implemented in systems self-test or verification in production line for these devices.Defective Comb Drive is detected by neural networks using as an input the resonance frequency and the gain.

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Section: B Failure Detectionmentioning

confidence: 99%

A Comparison of Neural Networks to Detect Failures in Micro-electro-mechanical Systems

Angel

Higuera

Bernal

et al. 2010

2010 IEEE Electronics, Robotics and Automotive Mechanics Conference

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“…Environment is also a part of the MEMS product system (Mir et al 2006;Persson and Boustedt 2002). The micromachined element is required to interact with the environment to sense/activate, but at the same time it is to be protected from the environment.…”

Section: Environment Subsystemmentioning

confidence: 99%

“…Different subsubsystems are identified for the environment subsystem and are shown in Fig. 5 (Mir et al 2006;Persson and Boustedt 2002;Tanner et al 2000;Shea 2006).…”

Section: Environment Subsystemmentioning

confidence: 99%

Structural modelling and integrative analysis of microelectromechanical systems product using graph theoretic approach

Prince

Agrawal

2009

Microsyst Technol

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Micro-electromechanical systems (MEMS) as an enabling technology is seen to play a more and more important role for the main stream of industry of the future by broadening its applications to information, communications and bio technologies. Development of MEMS devices, however, still relies on knowledge and experience of MEMS experts due to the design and fabrication process complexity. It is difficult to understand the trade-offs inherent in the system and achieve an optimal structure without any MEMS-related insight. An attempt is made to develop an integrated systems model for the complete structure of the MEMS product system in terms of its constituents and interactions between the constituents. The hierarchical tree structures of the MEMS system and its subsystems are presented up to component level. For characterization, analysis and identification of MEMS product system, three different mathematical models say graph theoretic model, matrix model and permanent model are presented. These models are associated with graph theory, matrix method and variable permanent function by considering the various subsystems, subsubsystems up to component level, their connectivity and interdependency of the MEMS product system. The developed methodology is explained with an example. The proposed modeling and analysis is extendable to the subsystems and the component level. An overall structural analysis can be carried out by following a 'top-down' approach or 'bottom-up' approach. Understanding of MEMS product structure will help in the improvement of performance, cost, design time, and so on.

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“…Since then a few other methodologies, following similar approaches, have been proposed for accelerometer testing (Charlot et al 2001;Mir et al 2006;Olbrich et al 1997;Puers and Reyntjens 2002;Xiong et al 2005). The test is limited to the verification whether the mass is free to move and an electrical signal is used to stimulate the device.…”

Section: Introductionmentioning

confidence: 99%

Auto-calibration of capacitive MEMS accelerometers based on pull-in voltage

et al. 2011

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This paper describes an electro-mechanical auto-calibration technique for use in capacitive MEMS accelerometers. Auto-calibration is achieved using the combined information derived from an initial measurement of the resonance frequency and the measurement of the pull-in voltages during device operation, with an estimation of process-induced variations in device dimensions from layout and deviations in material properties from the known nominal value. An experiment-based analytical model is used to compute the required electrostatic forces required to simulate external accelerations allowing the electro-mechanical calibration of the accelerometer. Measurements on fabricated devices confirm the validity of the proposed technique and electro-mechanical calibration is experimentally demonstrated.

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Built-in-self-test techniques for MEMS

Cited by 22 publications

References 15 publications

A Comparison of Neural Networks to Detect Failures in Micro-electro-mechanical Systems

A Comparison of Neural Networks to Detect Failures in Micro-electro-mechanical Systems

Structural modelling and integrative analysis of microelectromechanical systems product using graph theoretic approach

Auto-calibration of capacitive MEMS accelerometers based on pull-in voltage

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