Abstract:In this research, a BIST (built in self test) architecture for testing crosstalk effects in highly dense Through Silicon Via (TSV) placed in structured array form, in 3DICs (Three Dimensional integrated circuits), designed and simulated using the Xilinx ISE tool and the VHDL language.
A novel methodology is proposed, and simulated, to observe the test responses of the victim TSVs in the chosen group simultaneously. Boundary-scan cell structures are modified, created for the purpose of operating in different m… Show more
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