Three-Dimensional Nanoarchitectures 2011
DOI: 10.1007/978-1-4419-9822-4_3
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Building 3D Micro- and Nanostructures Through Nanoimprint

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Cited by 2 publications
(3 citation statements)
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“…87,88,89,90 Another potential benefit comes from the ability of nanoimprint to print multiple pattern levels simultaneously, which can result in a significant reduction in the number of process steps needed to complete a device. 91,92,93,94,95 Aside from meeting overlay requirements, the principal obstacle facing the technology is for it to achieve the same throughput and low level of defects 96 as photolithography.…”
Section: Nanoimprint Lithographymentioning
confidence: 99%
See 1 more Smart Citation
“…87,88,89,90 Another potential benefit comes from the ability of nanoimprint to print multiple pattern levels simultaneously, which can result in a significant reduction in the number of process steps needed to complete a device. 91,92,93,94,95 Aside from meeting overlay requirements, the principal obstacle facing the technology is for it to achieve the same throughput and low level of defects 96 as photolithography.…”
Section: Nanoimprint Lithographymentioning
confidence: 99%
“…Pattern placement capabilities close to those of photolithography tools have been achieved by introducing schemes that use controlled deformation of the imprint template. Such schemes, coupled with improvements in template fabrication processes, are currently suitable for IC manufacturing at feature sizes of ≈20 nm ( i.e. , the 2 x nm nodes). Another potential benefit comes from the ability of nanoimprint to print multiple pattern levels simultaneously, which can result in a significant reduction in the number of process steps needed to complete a device. Aside from meeting overlay requirements, the principal obstacle facing the technology is for it to achieve the same throughput and low level of defects as photolithography.…”
Section: Nanoimprint Lithographymentioning
confidence: 99%
“…This review is complemented by two other recent papers where two important aspects of molding have been presented, the similarities of NIL and LiGA and the description of the NIL process chains [35,36], including the main process steps such as origination, replication and pattern transfer. A range of further 3D micro-and nanostructures based on NIL can be found in [37]. In the following, the toolbox approach for NIL with focus on 3D processes will be presented, followed by applications with 3D features.…”
Section: Introductionmentioning
confidence: 99%