Nanomanufacturing: A Perspective

Liddle, J. Alexander; Gallatin, Gregg M.

doi:10.1021/acsnano.5b03299

Cited by 184 publications

(152 citation statements)

References 429 publications

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“…20,21 For example, locating dislocations within a nanoscale BCP pattern requires tedious inspection of highresolution scanning electron micrographs. Likewise, common high-resolution imaging techniques used for characterization of DNA nanostructures, such as atomic force microscopy (AFM) and transmission electron microscopy (TEM), cannot accommodate high throughput characterization.…”

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confidence: 99%

Metrology of DNA arrays by super-resolution microscopy

et al. 2017

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Recent results in the assembly of DNA into structures and arrays with nanoscale features and patterns have opened the possibility of using DNA for sub-10 nm lithographic patterning of semiconductor devices. Super-resolution microscopy is being actively developed for DNA-based imaging and is compatible with inline optical metrology techniques for high volume manufacturing. Here, we combine DNA tile assembly with state-dependent super-resolution microscopy to introduce crystal-PAINT as a novel approach for metrology of DNA arrays. Using this approach, we demonstrate optical imaging and characterization of DNA arrays revealing grain boundaries and the temperature dependence of array quality.For finite arrays, analysis of crystal-PAINT images provides further quantitative information of array properties. This metrology approach enables defect detection and classification and facilitates statistical analysis of self-assembled DNA nanostructures. IntroductionAs the costs and challenges of semiconductor device scaling increase, 1 new materials and technologies that enable precise patterning and placement of nanostructures are sought to supplement or replace current photolithography techniques. 2 For example, nanoscale patterning through directed self-assembly of block-copolymer (BCP) structures has been acknowledged as a viable and inexpensive lithographic mask via the International Technology Roadmap for Semiconductor manufacturing. 3,4 While progress has been made in the precise control of BCP self-assembly, defect densities and directed self-assembly of complex patterns remain challenges for manufacturing. 5 As an alternative technology, the potential for programmable, long-range order through self-assembly makes DNA an attractive material for bottom-up fabrication of nanoscale patterns, 6 as well as for templated-assembly of electronic and photonic devices with nanometer precision. 7-10Within the last two decades, DNA-based techniques such as origami, 6 tiles, 9 and bricks 11 have demonstrated precise control over the size, shape, arrangement, and assembly of DNA nanostructures and nanocomponents. While much work is still needed to approach commercial viability, lithographically confined DNA origami and large crystalline arrays of DNA origami show potential as self-assembled lithographic masks 12 and templates for precise nanoparticle assemblies. 13-18As a result of these advances, the Semiconductor Research Corporation recently listed DNAcontrolled sub-10 nm manufacturing as a technical area for its future roadmap. 19Beyond the ability to pattern at the nanoscale, metrology of patterned structures is a crucial capability in semiconductor device manufacturing that poses increasing challenges (e.g., cost, throughput, accuracy) as the device dimensions decrease. 20,21 For example, locating dislocations within a nanoscale BCP pattern requires tedious inspection of highresolution scanning electron micrographs. Likewise, common high-resolution imaging techniques used for characterization of DNA nanostructures, such as...

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confidence: 99%

Metrology of DNA arrays by super-resolution microscopy

et al. 2017

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“…However, if the deposition thicknesses are not strictly controlled, the stochastic nature of the bottom‐up fabrication approach52 may result in systematic or random radial displacement of the zones,43 and induce spherical aberrations. The tolerable radial displacement of the outermost zone has been calculated to be within two outermost zone widths 51.…”

Section: Resultsmentioning

confidence: 99%

3D Nanofabrication of High‐Resolution Multilayer Fresnel Zone Plates

et al. 2018

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Focusing X‐rays to single nanometer dimensions is impeded by the lack of high‐quality, high‐resolution optics. Challenges in fabricating high aspect ratio 3D nanostructures limit the quality and the resolution. Multilayer zone plates target this challenge by offering virtually unlimited and freely selectable aspect ratios. Here, a full‐ceramic zone plate is fabricated via atomic layer deposition of multilayers over optical quality glass fibers and subsequent focused ion beam slicing. The quality of the multilayers is confirmed up to an aspect ratio of 500 with zones as thin as 25 nm. Focusing performance of the fabricated zone plate is tested toward the high‐energy limit of a soft X‐ray scanning transmission microscope, achieving a 15 nm half‐pitch cut‐off resolution. Sources of adverse influences are identified, and effective routes for improving the zone plate performance are elaborated, paving a clear path toward using multilayer zone plates in high‐energy X‐ray microscopy. Finally, a new fabrication concept is introduced for making zone plates with precisely tilted zones, targeting even higher resolutions.

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Section: Scanning Probesmentioning

confidence: 99%

“…Developing lithographic techniques to construct sub-50 nm metallic nanostructures with arbitrary patterns and large height-to-width aspect ratio (AR) [1][2][3] is becoming a more important topic in recent years, because of the remarkable application potentials of these advanced structures in nanoelectronics, [4][5][6][7] high-efficiency diffractive optics and nanoplasmonics, [8][9][10][11] www.advmat.de www.advancedsciencenews.com ambient conditions, on the basis of the excellent ductility and the nanoscale cold welding behavior of Au. Because SNWL does not rely on any deduction or addition of materials, it not only allows one-step fabrication of 40-60 nm pure metal nanostructures with arbitrary shapes and tunable AR > 5 in ambient conditions, but also enables the side-selective erasing and rewriting of the fabricated nanostructures into a new design.…”

Section: Scanning Probesmentioning

confidence: 99%

Scanning Nanowelding Lithography for Rewritable One‐Step Patterning of Sub‐50 nm High‐Aspect‐Ratio Metal Nanostructures

et al. 2018

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The development of a new nanolithographic strategy, named scanning nanowelding lithography (SNWL), for the one-step fabrication of arbitrary high-aspect-ratio nanostructures of metal is reported in this study. Different from conventional pattern transfer and additive printing strategies which require subtraction or addition of materials, SNWL makes use of a sharp scanning tip to reshape metal thin films or existing nanostructures into desirable high-aspect-ratio patterns, through a cold-welding effect of metal at the nanoscale. As a consequence, SNWL can easily fabricate, in one step and at ambient conditions, sub-50 nm metal nanowalls with remarkable aspect ratio >5, which are found to be strong waveguide of light. More importantly, SNWL outweighs the existing strategies in terms of the unique ability to erase the as-made nanostructures and rewrite them into other shapes and orientations on-demand. Taking advantages of the serial and rewriting capabilities of SNWL, the smart information storage-erasure of Morse codes is demonstrated. SNWL is a promising method to construct arbitrary high-aspect-ratio nanostructure arrays that are highly desirable for biological, medical, optical, electronic, and information applications.

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Nanomanufacturing: A Perspective

Cited by 184 publications

References 429 publications

Metrology of DNA arrays by super-resolution microscopy

Metrology of DNA arrays by super-resolution microscopy

3D Nanofabrication of High‐Resolution Multilayer Fresnel Zone Plates

Scanning Nanowelding Lithography for Rewritable One‐Step Patterning of Sub‐50 nm High‐Aspect‐Ratio Metal Nanostructures

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