“…Here specific defect and aging mechanisms such as crosstalk or electromigration (EM) must be addressed, which can manifest themselves for example as delay faults or glitches at the gate level. In this context, the BIST and monitoring schemes proposed in [4,11,17,32,34,36,37,41,47,49,55,56], focus on manufacturing test, but they do not address the requirements and challenges of health monitoring during the lifetime. Nevertheless, because of the complex interplay between EM and crosstalk, periodic testing of interconnects is mandatory and at the same time Communicated by S. N. Demidenko extremely challenging.…”