Broadband Single-Pole Multithrow RF-MEMS Switches for Ka-Band

Stehle, A.; Georgiev, G.; Ziegler, Volker; Schoenlinner, Bernhard; Prechtel, U.; Schmid, U.; Seidel, H.

doi:10.1109/gemic.2009.4815911

Cited by 8 publications

(3 citation statements)

References 4 publications

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“…The design of the glass caps is extremely flexible, since almost any shape and size can be fabricated. It is possible to cover a single chip or even a whole wafer with one single glass cap [16]. An example of an optically encased window is shown at the end of this chapter in Section 12.11.1.…”

Section: Glass Encapsulationmentioning

confidence: 99%

MEMS Packaging Materials

Darrin

Osiander

2011

MEMS Reference Shelf

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This chapter discusses the differences between the heritage microcircuit packaging world and the still evolving MEMS packaging arena. Materials used in the packaging of MEMs are reviewed and their respective applications. The packaging schemes for these devices owe their infrastructure base to the body of knowledge surrounding semiconductors and microcircuits. MEMS devices yield new complexities which drive new packaging solutions. As opposed to traditional microcircuit chips, MEMS often include moving structures along with the need to have contact with the external environment, driving the requirements for packaging such components. Thus, some functions include interaction with the surrounding environment, such as pressure sensors. This imposes new requisites on packaging, since in regular microelectronics the chip must be protected completely from any impact from the environment. Packaging also provides mechanical support to the sensitive chip, facilitating the handling of the chip, and simplifying assembly. This chapter emphasizes the materials involved in packaging MEMS devices and the addresses the challenges involved. Included in this chapter are several case studies demonstrating novel packaging/material solutions. MEMS Packages and ApplicationsPackaging for MEMs provides for power and signal paths; thermal management; mechanical support; and environmental protection and/or interface protection. MEMS pose numerous packaging challenges that often drive custom solutions by the very nature of their configurations and applications. Commercialized MEMS products such as inkjets and airbag sensors use simple packaging solutions; but devices that involve environmental interface have special requirements that drive

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Section: Glass Encapsulationmentioning

confidence: 99%

MEMS Packaging Materials

Darrin

Osiander

2011

MEMS Reference Shelf

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“…In this fashion, it is possible to realize Single Pole Four Throw (SP4T), Single Pole Six Throw (SP6T), as well as more in generality Single Pole Multiple Throw (SPMT), featuring four, six and multiple outputs, respectively, as reported inGong et al . (2011) andStehle et al . (2009).…”

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confidence: 90%

RF MEMS passive components for wireless applications

Iannacci

2013

Handbook of Mems for Wireless and Mobile Applications

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“…ohmic [5,6] and capacitive [7,8] micro-relays with superior characteristics, their proper replication and (cross-) interconnection enabled the realisation of high-performance and widely reconfigurable RF-MEMS passive networks [9]. Thereafter, switching units ranging from single pole double throws (SPDTs) [10] to more complex single pole multiple throws (SPMTs) and switching matrices were successfully demonstrated in the literature [11]. Reconfigurable RF power attenuators [12] and splitter/couplers [13] can also be completely implemented using RF-MEMS technology, as can impedance matching tuners covering significant portions of the Smith chart [14][15][16].…”

Section: Introductionmentioning

confidence: 99%

RF-MEMS for future mobile applications: experimental verification of a reconfigurable 8-bit power attenuator up to 110 GHz

Iannacci

Tschoban

2017

J. Micromech. Microeng.

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RF-MEMS technology is proposed as a key enabling solution for realising the high-performance and highly reconfigurable passive components that future communication standards will demand. In this work, we present, test and discuss a novel design concept for an 8-bit reconfigurable power attenuator, manufactured using the RF-MEMS technology available at the CMM-FBK, in Italy. The device features electrostatically controlled MEMS ohmic switches in order to select/deselect the resistive loads (both in series and shunt configuration) that attenuate the RF signal, and comprises eight cascaded stages (i.e. 8-bit), thus implementing 256 different network configurations. The fabricated samples are measured (S-parameters) from 10 MHz to 110 GHz in a wide range of different configurations, and modelled/simulated with Ansys HFSS. The device exhibits attenuation levels (S21) in the range from −10 dB to −60 dB, up to 110 GHz. In particular, S21 shows flatness from 15 dB down to 3–5 dB and from 10 MHz to 50 GHz, as well as fewer linear traces up to 110 GHz. A comprehensive discussion is developed regarding the voltage standing wave ratio, which is employed as a quality indicator for the attenuation levels. The margins of improvement at design level which are needed to overcome the limitations of the presented RF-MEMS device are also discussed.

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Broadband Single-Pole Multithrow RF-MEMS Switches for Ka-Band

Cited by 8 publications

References 4 publications

MEMS Packaging Materials

MEMS Packaging Materials

RF MEMS passive components for wireless applications

RF-MEMS for future mobile applications: experimental verification of a reconfigurable 8-bit power attenuator up to 110 GHz

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