2017
DOI: 10.1109/tmtt.2016.2639018
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Broadband MMIC LNAs for ALMA Band 2+3 With Noise Temperature Below 28 K

Abstract: Recent advancements in transistor technology, such as the 35 nm InP HEMT, allow for the development of monolithic microwave integrated circuit (MMIC) low noise amplifiers (LNAs) with performance properties that challenge the hegemony of SIS mixers as leading radio astronomy detectors at frequencies as high as 116 GHz. In particular, for the Atacama Large Millimeter and Submillimeter Array (ALMA), this technical advancement allows the combination of two previously defined bands, 2 (67-90 GHz) and 3 (84-116 GHz)… Show more

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Cited by 31 publications
(24 citation statements)
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“…The complexity of designing an ultra-wideband embedding circuit is due to the difficulty of matching this broad range of impedances to the input impedance of the MMIC, typically of the order of 50 Ω. Examples of W-band LNAs with more than 40% RF bandwidth are shown in [12] and [23], and 50% in [21].…”
Section: Bandwidthmentioning
confidence: 99%
“…The complexity of designing an ultra-wideband embedding circuit is due to the difficulty of matching this broad range of impedances to the input impedance of the MMIC, typically of the order of 50 Ω. Examples of W-band LNAs with more than 40% RF bandwidth are shown in [12] and [23], and 50% in [21].…”
Section: Bandwidthmentioning
confidence: 99%
“…Microwave low noise amplifiers (LNAs) based on high electron mobility transistors (HEMTs) are widely-used components of scientific instrumentation in fields such as radio astronomy [1,2], deep space communication [3], and quantum computing [4][5][6][7][8]. After decades of development [9][10][11][12][13],…”
Section: Introductionmentioning
confidence: 99%
“…This is usually achieved through the application of a waveguide-to-microstrip (WG-MS) transition that transforms the impedance of the waveguide channel to the optimal conjugate impedance of the MMIC input or output port. At millimeter wavelengths, the WG-MS transition is typically fabricated from a thin film gold conductive layer, ∼3 μm in thickness, which is deposited onto a thin, <100 μm, quartz or alumina substrate and then suitably patterned to form a sequence of distributed elements [1][2][3].…”
Section: Introductionmentioning
confidence: 99%
“…Using WG-MS transitions at frequencies higher than 100 GHz presents three particular challenges: (1) due to the uncertainties in pre-packaging on-wafer probing, it is often difficult to determine precisely the optimal impedance required by the MMIC [4,5]; (2) simulating the interaction between the MMIC and the WG-MS transition is highly complex and thus prone to error; (3) once installed, the fabricated transition cannot be tuned in order to optimize the device packaged performance, i.e. to correct for the errors that may arise from 1 and 2.…”
Section: Introductionmentioning
confidence: 99%