Material removal caused by short high-intensity laser pulses is often termed pulsedlaser ablation (PLA). Throughout the literature, the terms laser-assisted evaporation, laser sputtering and, wrongly, laser etching, are also used. Within the regime under consideration, material removal takes place far from equilibrium and may be based on thermal or non-thermal microscopic mechanisms. For this reason, we will prefer the term laser ablation, which is less suggestive with respect to the fundamental mechanisms involved in the process. PLA permits one to widely suppress the dissipation of the excitation energy beyond the volume that is ablated during the pulse. For nanosecond pulses, this is fulfilled if the thickness of the layer ablated per pulse, h, is of the order of the heat penetration depth, l T ≈ 2(Dτ ) 1/2 , or the optical penetration depth, l α = α −1 , depending on which is the larger, i.e.,(12.0.1) This (simplified) condition is, in fact, the basic requirement for applications of the technique. Laser ablation has been demonstrated to be a powerful tool in micropatterning of hard, brittle, and heat-sensitive materials, and in the fabrication of thin films with complex stoichiometry. The latter technique is termed pulsed-laser deposition (Chap. 22). It is evident that (12.0.1) is a crude estimation. Because of the fast heating and cooling rates achieved with pulsed lasers, material damage or material segregation in multicomponent systems can often be ignored even in cases where the ablated layer thickness is considerably smaller than the value obtained from (12.0.1). With many materials, (12.0.1) can be reasonably well fulfilled with UV-laser light and nanosecond pulses. With VIS-and IR-laser radiation, this condition is often more difficult to fulfill because of the lower absorption observed with many materials at longer wavelength. Additionally, with increasing wavelength, laser-plasma interactions become more pronounced; these result in plasma shielding, oscillations in the energy-substrate coupling, etc. (Chap. 11). With both longer wavelengths and enhanced laser-plasma interactions, the resolution achieved in micropatterning decreases.With certain materials, nanosecond laser pulses are too long for high-quality and high-resolution surface patterning. Among those are metals, many semiconductors, D. Bäuerle, Laser Processing and Chemistry, 4th ed.,