2019
DOI: 10.1007/s40194-019-00804-2
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Brazing of porous copper foam/copper with amorphous Cu-9.7Sn-5.7Ni-7.0P (wt%) filler metal: interfacial microstructure and diffusion behavior

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Cited by 9 publications
(6 citation statements)
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“…Increasing the porosity of PMFSS from 70 to 90% resulted in decreased shear strengths from 7.7 to 0.9 MPa. Zahri et al (2020) studied the interfacial microstructure of Cu and Cu foam brazed joint. A high number of cavities were found in the brazing interface region for the highest pore density Cu foam leading to a low shear strength.…”
Section: Discussionmentioning
confidence: 99%
See 1 more Smart Citation
“…Increasing the porosity of PMFSS from 70 to 90% resulted in decreased shear strengths from 7.7 to 0.9 MPa. Zahri et al (2020) studied the interfacial microstructure of Cu and Cu foam brazed joint. A high number of cavities were found in the brazing interface region for the highest pore density Cu foam leading to a low shear strength.…”
Section: Discussionmentioning
confidence: 99%
“…The sample of Cu/filler/Cu foam/filler/Cu was undergone a brazing process at difference brazing temperatures (660C, 680C, 700C, and 720°C). Four different brazing temperature parameters were fixed above the filler liquidus temperature of 643°C (Zahri et al, 2020). The argon gas was used to avoid oxidation during brazing at a high temperature.…”
Section: Methodsmentioning
confidence: 99%
“…Filler foil of copper‐tin (9.7 %)‐nickel (5.7 %)‐phosphorus (7.0 %) (Metglas® Inc., USA) with dimension 10 mm×10 mm×40 μm was used for brazing copper and porous copper foam. The details study on the filler foil has been investigated in the previous work [18]. The copper/filler/porous copper foam/filler/copper specimen was arranged in a sandwich configuration as a protective structure, Figure 1a.…”
Section: Experimental Workmentioning
confidence: 99%
“…It is extensively used in electrical industry. Various studies and research were conducted to improve the physical and mechanical properties of Cu mainly on the nature of its thermal and electrical conductivity, in the area of Cu production processes or the preparation of alloyed Cu [1][2][3]. The graphene-copper alloys have become a hotpot where it has attracted many researchers globally to study on the mechanical and physical properties of the compositions [4,5].…”
Section: Introductionmentioning
confidence: 99%