“…However, the variation of solid solubility of Ti in TiN is less than 4 wt% from the brazing temperature to room temperature, indicating the interaction between TiN and Ti is relatively weak. Moreover, it has been widely known that in spite of the relatively strong compound formation tendency of the Cu-Ti system, the Ti element still appears as a single Ti rather than part of the Cu-Ti binary intermetallic [21]. Therefore, the above phenomena can be explained as follows:…”
Section: Effect Of Tinp Content On Microstructure Of the Brazed Jointsmentioning
“…However, the variation of solid solubility of Ti in TiN is less than 4 wt% from the brazing temperature to room temperature, indicating the interaction between TiN and Ti is relatively weak. Moreover, it has been widely known that in spite of the relatively strong compound formation tendency of the Cu-Ti system, the Ti element still appears as a single Ti rather than part of the Cu-Ti binary intermetallic [21]. Therefore, the above phenomena can be explained as follows:…”
Section: Effect Of Tinp Content On Microstructure Of the Brazed Jointsmentioning
“…Although active metal brazing is a simple and cost-effective technique to join ceramics and C/C has been joined to Ti [4], TiAl [5], Cu [6][7][8], and Ni [9][10][11] based alloys by active vacuum brazing. However, joining of C/C with the nickel-based single crystal super alloy has seldom been reported.…”
Section: Introductionmentioning
confidence: 99%
“…In comparison, the CTE of Rene N5 of about 12-16×10 −6 K −1 is much larger than that of C/C and the mismatch in the CTEs between C/C and Rene N5 results in large thermal stress at the joining interface during the brazing process. In this respect, several measures such as drilling [5], wave interface [13], and stress relief interlayer [9][10] have been taken to accommodate the thermal stress.…”
Section: Introductionmentioning
confidence: 99%
“…The Ti-rich liquid solidifies to yield a series of phases which construct the brazed joint (Zones E, F and G). The partial enthalpies of Ti solution in molten Cu, Ag and Ni at infinite dilution are about -10 kJ/mol, 39 kJ/mol and -187 kJ/mol, respectively[5,18,19], indicating that the Cu-Ti and Ni-Ti systems have a stronger compound formation tendency than the Ag-Ti system. The laminated structures marked E, F, G forms next to [Ag (s.s) + Cu (s.s) + Ti (Cu, Ni)] zone and the atomic ratios of Ti: (Ni+Cu) on these zones (E, F, G) are approximately 1:2, 1:3 and 1:2, respectively.…”
“…Wang et al [20] found that the isothermal solidification of Ag-based solid solution from a Ag-Cu-Ti filler metal led to a layered microstructure which was beneficial to the joining strength of carboncarbon composites to TiAl alloys. The addition of (Ti+C) mixed powder to the Ag-Cu-Ti alloy is reported by Cui et al [21] to induce reaction brazing of C/SiC composite to TC4 alloy.…”
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