“…Topdown strategies includes reaction ion etching, [11] electron beam lithography, [12] ion beam lithography, [13] optical lithography, [14] and nanoimprint, [15] etc. [16] while the bottom-up methods involve self-assembly, [17] template-based syntheses, [18] solution growth, [19] physical/chemical deposition, [20] electrophoresis/electro-deposition, [21,22] and so on. [23] Comparatively, the former could offer consistent structures, precise controllability, and reliable repeatability, but come with notable disadvantages, including the requirement for complex equipment, high costs, challenges in scaling up production, and difficulties in fabricating the arrays with intricate designs.…”