Bosch deep silicon etching: improving uniformity and etch rate for advanced MEMS applications

Schilp, A.; Funk, K.; Offenberg, M.

doi:10.1109/memsys.1999.746812

Cited by 127 publications

(74 citation statements)

References 10 publications

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“…During the fabrication of the devices, a Teflon-like film is deposited on the sidewalls [10]. This polymer, used as a passivation layer and deposited during plasma etching, is not removed at the end and is a very likely cause of the 12-mV drift observed over the first 10 days.…”

Section: A Surface Chargingmentioning

confidence: 99%

Stability of a micromechanical pull-voltage reference

Rocha

Cretu

Wolffenbuttel

2003

IEEE Trans. Instrum. Meas.

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Section: A Surface Chargingmentioning

confidence: 99%

Stability of a micromechanical pull-voltage reference

Rocha

Cretu

Wolffenbuttel

2003

IEEE Trans. Instrum. Meas.

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“…After the BOE, inductive coupled plasmas (ICP) dry etching is used to etch 230 µm deep channels and valves in the silicon. Here, the standard Bosch process is applied [40,41], which makes high aspect ratio silicon structures with vertical sidewalls possible [42]. Finally, the low pressure SF 6 plasma generated by a radio-frequency (RF) source is used to clean the C 4 F 8 deposition layer on the substrate and the walls of the channel and the valve.…”

Section: Design Of the Systemmentioning

confidence: 99%

Highly Sensitive and Miniaturized Fluorescence Detection System with an Autonomous Capillary Fluid Manipulation Chip

2012

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This paper presents a novel, highly sensitive and ultra-small fluorescent detection system, including an autonomous capillary fluid manipulation chip. The optical detector integrates a LED light source, all necessary optical components, and a photodiode with preamplifier into one package of about 2 cm × 2 cm × 2 cm. Also, the low-cost and simple pumpless microfluidic device works well in sample preparation and manipulation. This chip consists of capillary stop valves and trigger valves which are fabricated by lithography and then bonded with a polydimethylsiloxane-ethylene oxide polymer polydimethylsiloxane (PEO-PDMS) cover. The contact angle of the PEO-PDMS can be adjusted by changing the concentration of the PEO. Hence, the fluidic chip can achieve functionalities such as timing features and basic logical functions. The prototype has been tested by fluorescence dye 5-Carboxyfluorescein (5-FAM) dissolved into the solvent DMSO (Dimethyl Sulfoxide). The results prove a remarkable sensitivity at a pico-scale molar, around 1.08 pM. The low-cost and miniaturized optical detection system, with a self-control capillary-driven microfluidic chip developed in this work, can be used as the crucial parts in portable biochemical detection applications and point of care testing.

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“…Deep reactive ion etching (DRIE), addressed some of the limitations of wet etching, although the process is more expensive. Two main processes are cryogenic (Craciun 2001) and Bosch processes (Laemer 1999). The cryogenic process works at about -100 o C and uses oxygen to passivation of the sidewall during etching to maintain vertical etching.…”

Section: Bulk Micromachiningmentioning

confidence: 99%