Booming or emerging? China's technological capability and international collaboration in patent activities

Ma, Zhenzhong; Lee, Yender; Chen, Chien-Fu Patrick

doi:10.1016/j.techfore.2008.11.003

Cited by 95 publications

(45 citation statements)

References 20 publications

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“…For example, Dominique Guellec and de la Potteris (2001) proposed three indicators, i.e., SHIA, SHAI, and SHII to measure degree of internationalization and found the degree of technological internationalization is higher for small countries and for countries with low technological intensity [38]. Ma and Lee (2008) utilized co-invention index and co-assignee index to examine the pattern of international collaboration for eight most inventive OECD countries and two Asian countries between 1980 and 2005, a pattern of increasing collaboration in patent across the world over the past two decades were observed [27], and China's international patent had begun to boom along its fast economic growth [39]. Picci (2010) proposed three indicators, InvInv, InvApp, and AppApp, to assess internationalization of European patent between 1990 and 2005, and observed that the level of internationalization, while being rather low, has steadily increased over time.…”

Section: Patent For Investigating International Collaboration Networkmentioning

confidence: 99%

“…Since there is no direct approach, prior studies utilized indirect approaches which might be limited by incomplete data and thus lead the comparison among countries difficult. Those indirect approaches used in literature for measuring international R&D were, for example, foreign direct investments in R&D [33], foreign-affiliated R&D laboratories [34], foreign-owned R&D facilities [33], outsourced offshore R&D service [35], employees mobility [36,37], R&D and innovation surveys for obtaining up-to-date and detailed company-level data [23], patent citation [19], and international co-patenting [27,28,38,39]. In addition, the relationship between innovation and internationalization [40] was compared and a framework for analyzing different patterns of internationalization of R&D and innovation was proposed [41].…”

Section: Introductionmentioning

confidence: 99%

“…For example, Guellec and de la Potterie (2001) investigated internationalization of technology in the organization for economic co-operation and development (OECD) between 1993 and 1995 [38]. Ma and Lee (2008) and Ma et al (2009) [27,39]. Picci (2010) investigated European countries for a timespan between 1990 and 2005 [28].…”

Section: Introductionmentioning

confidence: 99%

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Global Interdependence of Collaborative R&D-Typology and Association of International Co-Patenting

2017

Sustainability

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Economic globalization implies a growing interdependence of resources across countries. Technological R&D and cross-border collaboration are often identified as the primary driving forces in the process. This study aims to holistically analyze global landscape of international collaboration and identify influential countries and the interdependencies among countries. A total of 458,381 international patents granted by the United States Patent and Trademark Office (USPTO) from 1976 to 2013 are analyzed and the structure of international collaboration network is created. It is found that highly developed and small countries usually show a higher degree of internationalization. However, emerging countries such as China present high collaborative influences. The highly skewed collaboration distribution indicates significant inequality of internationalization, which is indeed a hurdle to a country's technological mobility. It can be observed that most pairs of interdependent countries are neighboring or even bordering countries because of their similar historical, linguistic and cultural heritages. Several contributions of this study are summarized as follows: (1) this study first proposes the II, IA, II-IA, IA-AA, and II-IA-AA system for classifying international patent; (2) all international patents (38-year time span) from USPTO are examined without sampling; (3) association rule mining is used to evaluate the interdependency of international collaboration; and (4) network structures illustrating 38 years international co-patenting are visually presented.

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Section: Patent For Investigating International Collaboration Networkmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

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Global Interdependence of Collaborative R&D-Typology and Association of International Co-Patenting

2017

Sustainability

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“…Zhenzhong Ma et al (2009) evaluate China's technological capacity and frequency of international research cooperation using data on joint patent applications between China and other OECD countries submitted to the USPTO. Chia-Wen Hsu (2015) uses the intensity and diversity of national high-tech ventures as measures of innovation outcomes and R&D internationalization.…”

Section: Literature On the Internationalization Of Randd Cooperationmentioning

confidence: 99%

AN EXPLORATORY APPROACH TO KOREAN AND CHINESE INTERNATIONAL R&D COOPERATION: A GOVERNMENT PERSPECTIVE

Seo¹

2017

Proceedings of the 6th Business &Amp; Management Conference, Geneva

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“…Patent data can also be used in the study of international technological cooperation [43]. Scholars have studied international technological collaboration by patent data from various angles, including the collaboration network [21,44,45], collaboration pattern [20], driving factors [46], knowledge flow [24], industrial degree [25], national degree [47,48], etc. Although the academia has actively promoted the research of international technological collaboration and ICM industrial innovation by patent analysis, ICM international technological collaboration studies using patent data are not yet fully developed.…”

Section: Introductionmentioning

confidence: 99%

Exploring the Technological Collaboration Characteristics of the Global Integrated Circuit Manufacturing Industry

et al. 2018

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Abstract:With the intensification of international competition, there are many international technological collaborations in the integrated circuit manufacturing (ICM) industry. The importance of improving the level of international technological collaboration is becoming more and more prominent. Therefore, it is vital for a country, a region, or an institution to understand the international technological collaboration characteristics of the ICM industry and, thus, to know how to enhance its own international technological collaboration. This paper depicts the international technological collaboration characteristics of the ICM industry based on patent analysis. Four aspects, which include collaboration patterns, collaboration networks, collaboration institutions, and collaboration impacts, are analyzed by utilizing patent association analysis and social network analysis. The findings include the following: first, in regard to international technological collaboration, the USA has the highest level, while Germany has great potential for future development; second, Asia and Europe have already formed clusters, respectively, in the cooperative network; last, but not least, research institutions, colleges, and universities should also actively participate in international collaboration. In general, this study provides an objective reference for policy making, competitiveness, and sustainability in the ICM industry. The framework presented in this paper could be applied to examine other industrial international technological collaborations.

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Booming or emerging? China's technological capability and international collaboration in patent activities

Cited by 95 publications

References 20 publications

Global Interdependence of Collaborative R&D-Typology and Association of International Co-Patenting

Global Interdependence of Collaborative R&D-Typology and Association of International Co-Patenting

AN EXPLORATORY APPROACH TO KOREAN AND CHINESE INTERNATIONAL R&D COOPERATION: A GOVERNMENT PERSPECTIVE

Exploring the Technological Collaboration Characteristics of the Global Integrated Circuit Manufacturing Industry

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