Bonding strength enhancement by Ag–Zn–Cu intermetallic compounds and microscale tapers array fabricated by femtosecond laser

Wang, Cong; Li, Chuanqiang; Luo, Zhi; Li, Ming; Lin, Nai; Ding, Kan; Man, S.P.J. de; Duan, Ji’an

doi:10.1007/s10854-021-06473-6

J Mater Sci: Mater Electron

2021

DOI: 10.1007/s10854-021-06473-6

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Bonding strength enhancement by Ag–Zn–Cu intermetallic compounds and microscale tapers array fabricated by femtosecond laser

Cong Wang

Chuanqiang Li

Zhi Luo

et al.

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Cited by 4 publications

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J Mater Sci: Mater Electron

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Bonding strength enhancement by Ag–Zn–Cu intermetallic compounds and microscale tapers array fabricated by femtosecond laser

Cited by 4 publications

References 13 publications

Optimization and simulation of nano-silver paste sintered copper interconnection process

Optimization and simulation of nano-silver paste sintered copper interconnection process

Bonding strength enhancement of low temperature sintered SiC power module by femtosecond laser induced micro/nanostructures

Controllable hydrophilic titanium surface with micro-protrusion or micro-groove processed by femtosecond laser direct writing

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