2015
DOI: 10.1007/s10854-015-3640-9
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Bonding copper ribbons on crystalline photovoltaic modules using various lead-free solders

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Cited by 5 publications
(1 citation statement)
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“…These aspects essentially affect the module performance individually or in combination to one another. It has been reported that temperature variation causes breakage of interconnects, cells and solder joints [5][6][7]. The thermal fatigue essentially causes accumulation of strain energy due to the temperature loading, which causes such failures [8,9].…”
Section: Introductionmentioning
confidence: 99%
“…These aspects essentially affect the module performance individually or in combination to one another. It has been reported that temperature variation causes breakage of interconnects, cells and solder joints [5][6][7]. The thermal fatigue essentially causes accumulation of strain energy due to the temperature loading, which causes such failures [8,9].…”
Section: Introductionmentioning
confidence: 99%