2007
DOI: 10.1103/physrevb.75.155207
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Bond-order potential for silicon

Abstract: The tight-binding description of covalent bonding is used to propose a four-level, bond-order potential for elemental silicon. The potential addresses both the and bonding and the valence of this sp-valent element. The interatomic potential is parametrized using ab initio and experimental data for the diamond cubic, simple cubic, face-centered-cubic, and body-centered-cubic phases of silicon. The bond-order potential for silicon is assessed by comparing the predicted values with other estimates of the cohesive… Show more

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Cited by 33 publications
(22 citation statements)
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“…The structural and dynamical properties of amorphous silicon (a-Si) have been extensively investigated using classical force fields [1][2][3][4][5][6][7][8][9][10][11][12] , tight-binding [15][16][17][18] and ab-initio simulations 13,14,19 . Much attention, in particular, has been devoted to the characterization of defects 12,[20][21][22][23][24][25][26][27][28][29][30][31] .…”
Section: Introductionmentioning
confidence: 99%
“…The structural and dynamical properties of amorphous silicon (a-Si) have been extensively investigated using classical force fields [1][2][3][4][5][6][7][8][9][10][11][12] , tight-binding [15][16][17][18] and ab-initio simulations 13,14,19 . Much attention, in particular, has been devoted to the characterization of defects 12,[20][21][22][23][24][25][26][27][28][29][30][31] .…”
Section: Introductionmentioning
confidence: 99%
“…A small secondary peak is also evident at a bond angle of 501. We note that a [11 0]-split type interstitial defect has a bond angle of 501, while a tetrahedral defect has bonds with an angle of 701 [17]. The average coordination of these interstitials was obtained by visually identifying 100 interstitial atoms in the various simulations and determining their coordinations.…”
Section: Limitsmentioning
confidence: 99%
“…[17][18][19][20][21]. There are numerous ways to synthesize amorphous silicon including quenching from the melt [22], low-temperature vapor deposition [23][24][25], and ion bombardment [26,27].…”
Section: Simulation Detailsmentioning
confidence: 99%
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